3D EMI Shielding Wall for Semiconductor Connector Matrices

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Solution Overview

Problem

Existing electromagnetic interference (EMI) protection methods for printed circuit boards are expensive, heavy, and difficult to miniaturize, particularly for internal components like solder balls, connection pads, and connection pins, and do not effectively adapt to complex shapes.

Innovation Solution

A protective structure with a metallic coating forms a barrier between individual connectors, reflecting and absorbing EMI, connected to a ground track, and optionally covered by an insulation layer, using 3D printing to adapt to complex geometries and minimize material use.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If metallic shielding is used to protect components against EMI, then EMI protection effectiveness is improved, but weight and cost increase

Engineering Contradiction:

ImproveEMI protection effectivenessVSAvoidshielding structure weight

Core Design Contradiction:

Object-affected harmful factorsVSWeight of moving object

Solution Approach 1:

The patent divides the shielding structure into multiple segments corresponding to individual connectors or groups of connectors. Each segment is a separate metallic coating that can be independently formed, allowing selective shielding where EMI protection is most needed rather than shielding the entire component uniformly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The metallic coating is applied locally to specific areas around connectors where EMI protection is required, rather than covering the entire component. This localized approach reduces the total amount of shielding material needed, decreasing weight and cost while maintaining protection effectiveness in critical zones.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If traditional metal enclosures are used for EMI shielding, then protection effectiveness is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

ImproveEMI protection effectivenessVSAvoidshielding structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical metal enclosures and assemblies with a deposited metallic coating applied directly to the component surface. This eliminates the need for separate shielding components, fasteners, and assembly operations, significantly reducing device complexity and manufacturing difficulty.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The shielding function is merged with the component's existing structure by depositing the metallic coating directly onto the component surface. This integration eliminates separate shielding structures and their associated mounting hardware, simplifying the overall device design and manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If existing EMI protection methods are applied to connection matrices, then EMI between connectors is reduced, but adaptability to complex connector shapes is limited

Engineering Contradiction:

ImproveEMI between connectorsVSAvoidadaptability to complex shapes

Core Design Contradiction:

Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The patent utilizes the flexibility of deposition processes to change the physical parameters of the shielding application, including coating thickness, pattern density, and material composition. These parameter variations allow the shielding structure to adapt to complex connector geometries and provide optimized EMI protection for different connector types and arrangements.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The metallic coating acts as an intermediary layer that conformally follows the complex surface geometry of connectors. This intermediate shielding layer adapts to irregular shapes and tight spaces between connectors, providing effective EMI protection where traditional rigid enclosures would fail to conform.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces EMI between connectors, protects sensitive components, and maintains connectivity while being lightweight and adaptable to complex shapes, with significant reductions in electromagnetic fields and magnetic fields.

Implementation Method 1

When EMI comes into contact with the shielding wall, the metal wall reflects most of the electromagnetic waves

Methodology Applied

Scientific EffectReflection: Reflection

Implementation Method 2

some of the EMI is absorbed and converted into heat

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 3

The remaining energy is confined within the metal wall due to the skin effect, thus preventing the EMI from reaching sensitive electronic components on the other side of the metal wall

Methodology Applied

Scientific EffectSkin effect: Skin Effect

Data Source

PatentEP4704542A13D electromagnetic interference shielding structure for semiconductor device

Publication Date: 2026.03.04 STMICROELECTRONICS INT NV

Figure 1~2A
Figure 2B
Figure 2C

AI summary

Semiconductor device comprising an integrated circuit package (1) having a connection matrix (6) for connection to a printed circuit board (15) characterized in that the integrated circuit package (1) includes a protective structure (2) against electromagnetic interference of the elementary connectors (3, 4), such as balls, formed by a 3D printed deposition of a protective metallic wall (11) between the elementary connectors (3, 4).