3D Stacked Programmable Logic Fabric for Low-Latency CPU Offload
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Solution Overview
Problem
Existing 2D programmable logic fabric architectures face limitations in flexibility and efficiency due to high latency and low bandwidth in offload computing, restricting fine-grained acceleration capabilities and requiring significant architecture changes, which limits reconfigurability and the ability to perform various compute tasks effectively.
Innovation Solution
A 3D stacked architecture integrating a programmable logic fabric and a processor, allowing for reconfigurable sections to perform both coarse-grained and fine-grained acceleration, with the programmable fabric being partitioned according to performance requirements and enabling custom instructions for specific workloads, thereby overcoming the limitations of traditional 2D designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If 2D programmable logic fabric architecture is used, then device complexity is reduced, but latency increases and bandwidth decreases
Solution Approach 1:
The patent transitions from a two-dimensional programmable logic fabric architecture to a three-dimensional stacked architecture. This dimensional change enables vertical integration of compute elements with the programmable fabric, reducing the physical distance for data transfer and interconnection, thereby lowering latency and increasing bandwidth while maintaining manageable device complexity through modular stacking
2Ease of manufacture
If 2D programmable logic fabric architecture is used, then manufacturing is simpler, but fine-grained acceleration capability is limited
Solution Approach 1:
The patent segments the programmable fabric into multiple reconfigurable sections that can be independently configured. Each section can be programmed to perform specific fine-grained acceleration tasks. This segmentation allows the fabric to be manufactured using standard processes while enabling versatile fine-grained acceleration through software-defined configuration of individual sections
3Productivity
If architecture changes are made for fine-grained acceleration, then acceleration performance improves, but reconfigurability is limited
Solution Approach 1:
The patent implements dynamic reconfigurability where the programmable fabric sections can be reprogrammed at runtime to change their acceleration functions. The architecture maintains high fine-grained acceleration performance through dedicated compute elements while allowing these elements to be dynamically reassigned to different tasks via configuration interfaces, enabling both high performance and adaptability
4Speed
If 3D stacked architecture is implemented, then latency is reduced and bandwidth is increased, but device complexity increases
Solution Approach 1:
The patent implements a three-dimensional stacked architecture where compute elements are vertically integrated with the programmable fabric through high-speed interconnects. This vertical stacking reduces the physical distance for data transfer, increasing bandwidth and reducing latency. The complexity is managed through standardized stacking interfaces and modular design patterns that allow the complex 3D structure to be constructed from simpler, standardized components
Data Source
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AI summary
The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.