3D Foldable PCB Assembly With Vertical Interface for Signal Integrity
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Solution Overview
Problem
Existing electronic device packaging designs with corners or bends hinder component mounting, leading to signal and power integrity degradation due to excessive vertical interconnects, which previous solutions attempted to address through thicker dual-sided PCBs or direct board-to-board attachments, resulting in increased manufacturing costs and reduced system form-factor.
Innovation Solution
The implementation of a 3D foldable PCB assembly with a peripheral vertical interface, where components are mounted directly on a flexible substrate, allowing for form-factor miniaturization by repartitioning electronic components and reducing signal path transitions through a flexible substrate with rigid substrates and conductive traces, thereby minimizing signal degradation and mechanical constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional corner or bend packaging designs are used, then manufacturing simplicity is maintained, but component mounting is hindered and signal integrity degrades
Solution Approach 1:
The patent transitions from traditional 2D planar PCB layouts to a 3D folded configuration, utilizing vertical and lateral dimensions to route signals and mount components. This dimensional change allows signals to travel through multiple planes and levels, avoiding the need for excessive vertical interconnects while maintaining signal integrity and enabling component mounting in previously inaccessible areas.
Solution Approach 2:
The PCB is divided into multiple rigid substrates connected by flexible interconnects, creating a segmented structure. This segmentation allows each rigid substrate to be optimized for component mounting while the flexible segments provide signal routing pathways, resolving the conflict between manufacturing ease and signal integrity by distributing functions across segments.
2Reliability
If thicker dual-sided PCBs are used to address signal degradation, then signal integrity improves, but system form-factor increases and manufacturing costs increase
Solution Approach 1:
Instead of increasing PCB thickness to improve signal integrity, the patent utilizes lateral and vertical routing through folded configurations. Signals are routed through flexible interconnects and across multiple rigid substrate planes, achieving signal integrity without increasing the vertical thickness of individual PCB layers, thus maintaining compact system form-factor.
Solution Approach 2:
The patent employs thin flexible substrates as interconnects between rigid PCB sections. These flexible films provide signal routing pathways with controlled impedance, maintaining signal integrity while occupying minimal volume. The thin-film approach avoids the need for thicker rigid PCBs, preserving compact system form-factor.
3Ease of manufacture
If direct board-to-board attachments are used, then manufacturing costs increase, but signal path transitions are reduced
Solution Approach 1:
The patent merges multiple PCB functions into a single integrated folded structure, combining rigid substrates, flexible interconnects, and component mounting areas. This integration eliminates the need for separate board-to-board attachments, reducing manufacturing complexity and costs while maintaining continuous signal paths through the folded configuration, thus reducing signal path transitions.
4Ease of manufacture
If components are mounted on rigid substrates only, then manufacturing simplicity is maintained, but space utilization is inefficient
Solution Approach 1:
The patent extends component mounting areas into the vertical and lateral dimensions through folded configurations. Rigid substrates are positioned at different orientations and levels, creating three-dimensional mounting surfaces. This allows efficient space utilization by distributing components across multiple planes while maintaining manufacturing simplicity through standardized rigid substrate processes.
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.