3D Video Display Frame Assembly for Stable Sensor Positioning

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Solution Overview

Problem

Existing 3D video communication systems face challenges in maintaining precise relative positioning of image sensors due to thermally induced distortion and warping of structural components, which affects the quality of 3D image output.

Innovation Solution

A frame assembly is used to mount image sensors at the periphery of the display device, isolated from structural components, preventing load transfer and maintaining sensor position despite deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If image sensors are mounted directly on structural components of the display device, then device complexity is reduced, but manufacturing precision deteriorates due to thermally induced distortion and warping

Engineering Contradiction:
Improvemounting structure complexityVSAvoidsensor positioning precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The mounting structure is segmented into two independent parts: a support frame for mounting image sensors and a mounting portion for mounting the display device. This segmentation isolates the sensors from structural components that undergo thermal deformation, preventing distortion from affecting sensor positioning precision while maintaining relatively simple device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support frame acts as an intermediary between the mounting portion and the image sensors. It provides a stable mounting platform for sensors that is isolated from the deformation of structural components through the compliant frame portion, thereby maintaining manufacturing precision without significantly increasing device complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If image sensors are mounted on rigid structural components, then manufacturing precision is improved, but reliability deteriorates due to thermally induced distortion

Engineering Contradiction:
Improvesensor positioning precisionVSAvoidposition stability under thermal conditions
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The compliant frame portion is implemented as a flexible structural element that can deform to accommodate thermal expansion and warping of the backplate. This flexibility allows the rigid support frame to remain stable and maintain sensor positioning precision even when the display device undergoes thermal deformation, thereby improving reliability under thermal conditions.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The system utilizes controlled flexibility in the compliant frame portion that changes its mechanical properties in response to thermal conditions. This allows the structure to adapt to thermal expansion and warping while the rigid support frame maintains stable sensor positioning, resolving the contradiction between manufacturing precision and reliability under thermal stress.

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If the support frame is directly coupled to the backplate, then device complexity is reduced, but manufacturing precision deteriorates due to load transmission from backplate deformation

Engineering Contradiction:
Improveframe assembly complexityVSAvoidsensor position consistency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The frame assembly is segmented into a support frame and a mounting portion that are coupled through a compliant frame portion. This segmentation creates an isolated mounting environment for image sensors that is protected from loads transmitted by backplate deformation, maintaining sensor position consistency without excessive complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support frame is extracted and isolated from direct coupling with the backplate through the compliant frame portion. This extraction removes the transmission path for deformation loads, allowing the support frame to maintain stable sensor positioning independent of backplate deformation while keeping the overall device complexity manageable.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12578055B2Frame assembly for a three-dimensional video communication system
Publication Date: 2026.03.17 GOOGLE LLC
  • US12578055B2 patent drawing
  • US12578055B2 patent drawing
  • US12578055B2 patent drawing

AI summary

A frame assembly for a three-dimensional (3D) communication system provides for mounting of a plurality of image sensors adjacent to, and physically separate from, peripheral boundaries of a display device of the 3D communication system, while also providing for mounting of the display device to an external support structure. The frame assembly includes a support frame that provides for mounting of the plurality of image sensors at the periphery of the display device, and a mounting structure that provides for mounting of the display device, using shared mounting points that do not rely on a mechanical coupling between the display device and the support frame. In this manner, the frame assembly can maintain a relative position of the plurality of image sensors, even in the event of physical changes in configuration of the display device.