3D Heat Dissipation Member for Power Semiconductor Cooling
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Solution Overview
Problem
Conventional semiconductor devices with power switching elements face challenges in efficient heat dissipation, which can lead to reduced performance and reliability in high-power applications.
Innovation Solution
The semiconductor device incorporates a heat dissipation member with a complex three-dimensional shape, featuring a matrix arrangement of first and second protrusions, which enhances contact area with cooling media and facilitates efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional flat heat dissipation structure is used, then the device complexity is low, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation member transitions from a conventional flat two-dimensional structure to a three-dimensional structure with multiple protrusions extending in different directions. This dimensional change increases the heat dissipation surface area and creates multiple heat dissipation paths, thereby improving heat dissipation efficiency while accepting increased structural complexity
Solution Approach 2:
The heat dissipation member is divided into multiple protrusions (first protrusions extending in a first direction, second protrusions extending in a second direction) rather than using a single flat surface. This segmentation creates numerous discrete heat dissipation elements that can independently transfer heat to the cooling medium, enhancing overall heat dissipation performance
2Temperature
If a complex three-dimensional heat dissipation structure with multiple protrusions is used, then the heat dissipation efficiency is improved, but the manufacturing difficulty increases
Solution Approach 1:
The heat dissipation member serves multiple functions simultaneously: it provides thermal conduction from the semiconductor element, creates convection currents through its three-dimensional protrusion structure, and offers structural support. This multi-functionality justifies the increased manufacturing complexity by delivering superior heat dissipation performance that cannot be achieved with simpler structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables quick dissipation of heat from semiconductor elements, improving the thermal management of the semiconductor device and enhancing its performance and reliability in high-power applications.
Implementation Method 1
a heat dissipation member configured to come into contact with cooling media flowing in a heat dissipation chamber
Implementation Method 2
cooling media flowing in a heat dissipation chamber
Data Source
AI summary
A semiconductor device includes a first semiconductor element, a second semiconductor element, a support substrate and a sealing resin, and further includes a heat dissipation member disposed on the reverse surface. The heat dissipation member includes a plurality of first protruding elements each including a first base portion, a second base portion, a first standing portion, a second standing portion, and a first end portion. The plurality of first protruding elements are arranged in a matrix along a plane containing the first direction and the second direction.