3D Heat Exchanger Integrating Heat Pipes and Vapor Chamber
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current heat dissipation systems combining heat pipes and vapor chambers operate independently, limiting the potential for enhanced heat transfer efficiency.
Innovation Solution
A three-dimensional heat exchanger design that integrates a vapor chamber and heat pipes, featuring thermally conductive plates, supporting structures, capillary structures, and heat pipes, allowing for combined two-dimensional and one-dimensional heat transfer to achieve high efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat pipes and vapor chambers are used independently in heat dissipation systems, then each component can perform its specific heat transfer function, but the overall heat transfer efficiency is limited due to lack of integration
Solution Approach 1:
The patent merges heat pipes and vapor chambers into a single integrated three-dimensional heat exchanger structure. The heat pipes are arranged vertically within the vapor chamber, with their evaporating ends connected to the heating surface and condensing ends extending into the vapor chamber space. This integration allows the components to work together as a unified system rather than independent elements, thereby improving overall heat transfer efficiency while managing the complexity through a coordinated structural design.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar heat transfer configurations to a three-dimensional structure. The vertical arrangement of heat pipes within the vapor chamber creates additional spatial dimensions for heat transfer pathways. This three-dimensional configuration increases the heat transfer area and creates multiple heat transfer routes, enabling more efficient heat dissipation compared to conventional planar designs.
2Loss of energy
If traditional two-dimensional vapor chamber structure is used, then the structure is simple, but the heat transfer efficiency is limited compared to three-dimensional heat transfer
Solution Approach 1:
The patent transforms the conventional two-dimensional vapor chamber into a three-dimensional structure by incorporating vertically arranged heat pipes. The heat pipes extend from the heating surface through the vapor chamber, creating three-dimensional heat transfer pathways. This dimensional enhancement increases the heat transfer area and creates multiple heat transfer routes, significantly improving heat transfer efficiency while maintaining reasonable structural complexity through systematic arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of vapor chambers and heat pipes in the three-dimensional heat exchanger enhances heat transfer efficiency by enabling three-dimensional heat transfer, improving upon the limitations of independent systems.
Implementation Method 1
The working fluid flowing to the condensation space is condensed into liquid and then flows back to the evaporation space with the help of the capillary structure
Implementation Method 2
The at least one thermally conductive structure is connected to at least a part of the plurality of supporting structures
Implementation Method 3
The working fluid in the evaporation space is evaporated into vapor, and then flows to the condensation space due to the pressure difference. The working fluid flowing to the condensation space is condensed into liquid
Data Source
AI summary
A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.