3D Heat Flow Structures for Electronics Thermal Management
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Solution Overview
Problem
Existing electronics assemblies face challenges in effectively cooling heat-generating components located away from a cooling device in three-dimensional space, leading to increased costs and size due to the need for additional cooling devices.
Innovation Solution
The implementation of three-dimensional heat flow structures that thermally couple heat-generating components to a cooling device positioned outside their plane, using a first portion parallel to the substrate and a second portion extending transversely to the cooling device, thereby creating a three-dimensional heat flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional cooling devices are added to cool heat-generating components located away from the cooling device, then the heat removal capability is improved, but the cost and size of the electronics assembly increase
Solution Approach 1:
The patent extends the heat flow path from a traditional planar configuration to a three-dimensional structure that protrudes from the substrate surface. This dimensional transition allows heat-generating components located away from the cooling device to be thermally coupled to the cooling device through a heat flow path that extends in the vertical dimension, eliminating the need for additional cooling devices while maintaining effective heat removal
Solution Approach 2:
The heat flow path structure serves multiple functions: it provides mechanical support for heat-generating components, establishes thermal coupling between distant components and the cooling device, and enables three-dimensional heat dissipation. This multi-functionality allows a single structure to replace what would traditionally require multiple separate cooling devices
2Temperature
If additional cooling devices are added to cool heat-generating components located away from the cooling device, then the heat removal capability is improved, but the size of the electronics assembly increases
Solution Approach 1:
By transitioning from a planar to a three-dimensional heat flow path configuration, the patent enables heat removal from components located away from the cooling device without requiring additional horizontal space. The vertical extension of the heat flow path utilizes the z-dimension, allowing heat dissipation within the existing footprint of the electronics assembly and avoiding an increase in overall assembly size
3Temperature
If a three-dimensional heat flow structure is implemented to thermally couple heat-generating components to a cooling device, then the heat removal efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The heat flow path is divided into distinct segments: a substrate portion and a protruding portion with different cross-sectional areas. This segmentation allows each portion to be optimized independently for its specific function while simplifying the overall manufacturing process, as each segment can be fabricated using standard techniques and then assembled
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient heat removal from heat-generating components without the need for additional cooling components, maintaining their operating temperature below the maximum by directing heat flux through three-dimensional space to the cooling device.
Implementation Method 1
The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device
Data Source
AI summary
Electronics assemblies incorporating three-dimensional heat flow structures are disclosed herein. In one embodiment, an electronics assembly includes a substrate having a surface defining a plane, a heat generating component coupled to the surface of the substrate, a cooling device positioned outside of the plane defined by the surface of the substrate, and a three-dimensional heat flow structure. The three-dimensional heat flow structure includes a first portion thermally coupled to the heat generating component and a second portion extending from the first portion. At least a portion of the first portion is parallel to the plane defined by the substrate. The second portion is transverse to the plane defined by the surface of the substrate. The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.