3D Heat Conducting Structure With Laser-Sealed Heat Pipe Joints

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Solution Overview

Problem

Conventional soldering techniques in heat conducting structures result in solder overflow and appearance defects, leading to reduced production yield and compromised structural integrity due to gaps between the heat pipe and vapor chamber.

Innovation Solution

A three-dimensional heat conducting structure is formed by laser welding the gaps between the heat pipe and vapor chamber rim, followed by soldering a welding ring to secure the connection, preventing solder overflow into the vapor chamber.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional soldering techniques are used to join the heat pipe and vapor chamber, then the connection strength is improved, but solder overflow occurs into the vapor chamber causing appearance defects and reduced production yield

Engineering Contradiction:
Improveconnection strengthVSAvoidsolder overflow control
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

Laser welding is performed before soldering to pre-seal the gaps between the heat pipe and vapor chamber rim. This preliminary action creates a barrier that prevents solder from overflowing into the vapor chamber during the subsequent soldering process, while still allowing the solder to provide structural support and connection strength.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The joining process is divided into two distinct stages: first laser welding to seal gaps, then soldering to secure connection. This segmentation allows each process to perform its specific function optimally without interfering with the other, preventing solder overflow while maintaining connection strength.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If gaps exist between the heat pipe and vapor chamber rim, then the assembly process is simplified, but melted solder flows into the vapor chamber causing harmful effects

Engineering Contradiction:
Improveassembly simplicityVSAvoidsolder flow into vapor chamber
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The gaps are sealed by laser welding before the soldering process. This preliminary sealing action eliminates the harmful effect of solder flowing into the vapor chamber while maintaining the simplicity of the overall assembly process, as the laser welding automatically seals gaps without requiring additional manual intervention.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The laser welding process, which initially seems to add complexity, actually converts the potential harm of gaps (solder overflow) into a benefit by creating a sealed pathway that directs solder away from the vapor chamber interior while maintaining structural integrity.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Manufacturing precision

If laser welding is applied to seal gaps before soldering, then solder overflow is prevented, but the manufacturing process complexity increases

Engineering Contradiction:
Improvesolder overflow preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manual or mechanical gap sealing process is replaced with automated laser welding technology. This substitution prevents solder overflow through precise energy-controlled welding while reducing the need for complex manual operations, as the laser system can be programmatically controlled to seal gaps consistently without adding significant process complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method ensures a secure, gap-free connection, enhancing thermal efficiency and reliability by minimizing heat spread and maintaining structural integrity.

Implementation Method 1

gaps between the heat pipe and the edge of the vapor chamber hole are sealed by laser welding

Methodology Applied
Scientific EffectLaser welding: Laser Beam Welding

Implementation Method 2

a soldering process is used to ensure a secure connection between the heat pipe and the vapor chamber

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentEP4703667A1Three-dimensional heat conducting structure and manufacturing method thereof
Publication Date: 2026.03.04 PURPLE CLOUD DEV PTE LTD
  • EP4703667A1 patent drawingFigure 1
  • EP4703667A1 patent drawingFigure 2
  • EP4703667A1 patent drawingFigure 3~3A

AI summary

A three-dimensional heat conducting structure includes a vapor chamber that has a casing with at least one through hole and is in fluid communication with an interior of the casing. At least one heat pipe having an open end that is inserted into the through hole and is in fluid communication with the interior of the casing. Further, a rim that is disposed on an outer surface of the vapor chamber, wherein gaps between the rim and the heat pipe are sealed by laser welding, and a welding ring is soldered to further secure the connection between the heat pipe and the vapor chamber.