3D Heat Pipe Memory Cooling for Dense DIMM Spacing
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Solution Overview
Problem
Conventional heat dissipation structures for memory modules, such as dual in-line memory modules (DIMMs), face limitations in efficiency and uniformity, particularly at small spacings, leading to uneven heat dissipation and failure to meet increasing heat dissipation requirements due to the limitations of 2D heat pipes and thermal interface materials (TIMs).
Innovation Solution
A cooling configuration utilizing a three-dimensional (3D) heat pipe design with a flat heat pipe and a heat sink, where the heat pipe portions extend orthogonally to enhance heat dissipation, coupled with an external cooling device, and a thermal interface material (TIM) to ensure uniform contact and improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional 2D heat pipe structures are used for memory module cooling, then the device complexity remains low, but the heat dissipation efficiency is insufficient to meet increasing thermal requirements
Solution Approach 1:
The patent transitions from conventional 2D heat pipe structures to a 3D heat pipe configuration where multiple heat pipe portions extend in different spatial directions (orthogonal extensions) from the memory module surfaces. This dimensional change enables heat to be conducted away from multiple surfaces simultaneously, significantly improving heat dissipation efficiency while maintaining reasonable structural complexity through systematic arrangement of the heat pipe components.
2Productivity
If memory modules are placed at small spacings to increase density, then the productivity and space utilization improve, but the heat dissipation uniformity deteriorates due to limited cooling coverage
Solution Approach 1:
The cooling system is segmented into multiple independent heat pipe portions (first heat pipe portion, second heat pipe portion, third heat pipe portion, fourth heat pipe portion) that can be independently configured to contact different surfaces of the memory module. This segmentation allows each heat pipe portion to independently manage heat from specific regions, ensuring uniform heat dissipation across the entire module even when modules are densely packed at small spacings.
Solution Approach 2:
By extending heat pipe portions in orthogonal directions from the memory module surfaces, the cooling coverage is expanded into three-dimensional space. This allows the cooling system to effectively reach heat sources on multiple surfaces simultaneously, maintaining heat dissipation uniformity even when memory modules are placed at small spacings with limited clearance for conventional single-surface cooling.
3Loss of energy
If thermal interface materials are used to ensure contact between heat pipe and memory module, then the heat transfer improves, but the device complexity and assembly steps increase
Solution Approach 1:
A thermal interface material is introduced as an intermediary substance between the heat pipe portions and the memory module surfaces. This intermediary ensures optimal thermal contact and heat transfer efficiency by filling microscopic gaps and conforming to surface irregularities, while the overall assembly structure remains relatively simple through direct attachment of the heat pipe portions to the module surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D heat pipe configuration achieves higher heat dissipation efficiency, meets increasing heat dissipation requirements, and ensures uniform coverage of memory module surfaces, addressing the limitations of conventional 2D heat pipe systems.
Implementation Method 1
The example heat pipe is structured to include a first heat pipe portion, which is sometimes referred to herein as a main heat receiving portion
Implementation Method 2
The main heat dissipation surfaces of the first heat pipe portion are parallel to the at least one side of the surfaces of the memory board
Implementation Method 3
at least one main heat dissipation surface of the third heat pipe portion is structured to contact an external cooling device directly or via a thermal interface material (TIM)
Implementation Method 4
a heat sink structured in a plate-like structure and to be arranged between the memory board and the heat pipe
Implementation Method 5
These memory modules generate considerable heat when operating
Data Source
AI summary
Systems and apparatus are disclosed for cooling configuration for memory devices. An example cooling device includes a heat sink further including a longitudinal length having a left end, a right end, and a first planar orientation, a transverse height having a top, a bottom, and a second planar orientation orthogonal to the first planar orientation, and an inner side and an outer side, the outer side including at least one channel having the second planar orientation. The example cooling device also includes a first heat pipe further including a first heat pipe portion having a left end, a right end, and the second planar orientation, the first heat pipe portion seated into the at least one channel, a heat pipe transition portion coupled to the left end of the first heat pipe portion, the transition portion including a first end having the second planar orientation and a second end having the first planar orientation, and a heat dissipation portion coupled to the second end of the heat pipe transition portion.