3D Heat Transfer Device for Vapor Return Using Blocking-Flow Wicks

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Solution Overview

Problem

Conventional heat transfer devices face challenges with the efficient return of vaporized working fluid, leading to suboptimal heat dissipation efficiency due to independent operation of capillary structures in the heat transfer plate and heat pipe.

Innovation Solution

A three-dimensional heat transfer device with a thermal conductive shell body and connected pipes, featuring blocking-flow wicks and multiple wicks with varying porosities to manage vaporized and liquid cooling fluid flow, enhancing heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If capillary structures in the heat transfer plate and heat pipe are kept independent (not connected), then each structure can maintain its own capillary force, but the return efficiency of vaporized working fluid decreases

Engineering Contradiction:
Improvecapillary force maintenanceVSAvoidworking fluid return efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent connects the capillary structures of the heat transfer plate and heat pipe through a communication channel, merging them into a unified capillary network. This allows the capillary forces to work cooperatively, improving the return efficiency of vaporized working fluid while maintaining reliable capillary action throughout the system.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a communication channel as an intermediary structure that connects the heat transfer plate and heat pipe. This channel serves as a mediator that enables fluid communication between the two previously independent capillary structures, facilitating improved fluid return without compromising capillary force.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If capillary force is increased to improve heat dissipation efficiency, then heat transfer performance improves, but the device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcapillary structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The communication channel serves multiple functions: it connects the heat transfer plate and heat pipe, enables fluid communication between them, and provides a pathway for vaporized working fluid return. This multi-functionality improves heat dissipation efficiency without requiring separate complex structures for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the capillary networks of the heat transfer plate and heat pipe into a unified system through the communication channel. This consolidation allows both components to work together as a single capillary system, improving overall heat dissipation efficiency while reducing the complexity that would arise from maintaining separate, independent capillary structures.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device improves heat dissipation efficiency by optimizing the return of vaporized cooling fluid, providing lower thermal resistance and higher heat transfer capacity through enhanced heat dissipating areas and controlled fluid flow.

Implementation Method 1

a wick that guides a flow direction of the liquid cooling fluid

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

at least one blocking-flow wick disposed in the second pipe body... the blocking-flow wick... to manage vaporized and liquid cooling fluid flow

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

a thermal conductive shell body having a liquid-tight chamber, at least one first pipe having a first end connected to the thermal conductive shell body... providing lower thermal resistance and higher heat transfer capacity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4579166A1Three-dimension heat transmission device
Publication Date: 2025.07.02 PURPLE CLOUD DEV PTE LTD
  • EP4579166A1 patent drawingFigure 1
  • EP4579166A1 patent drawingFigure 2
  • EP4579166A1 patent drawingFigure 3

AI summary

A three-dimensional (3D) heat transfer device that includes a thermal conductive shell body having a liquid-tight chamber, at least one first pipe having a first end connected to the thermal conductive shell body and in communicate with the liquid-tight chamber, and at least one second pipe having at least two portions that are connected to the thermal conductive shell and in communicate with the liquid-tight chamber.