3D Heat Transfer Plate With Deformable Protrusions
Solution Overview
Problem
Conventional heat transfer methods in electronic power units, such as heat conducting sheets and pastes, face challenges in achieving efficient heat dissipation due to thermal resistance issues caused by surface irregularities and contact pressures, particularly in compact power modules generating significant waste heat.
Innovation Solution
A 3-dimensional heat transfer plate with deformable contact protrusions is used between the component and cooling device, allowing for maximum contact surface area and deformation during assembly to compensate for tolerances and enhance thermal conductivity without the need for additional heat conducting materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat conducting sheets or pastes are used, then thermal connection is achieved, but thermal resistance increases due to surface irregularities and contact pressure limitations
Solution Approach 1:
The invention transitions from conventional 2D heat conducting sheets to a 3D heat transfer plate with contact protrusions. These protrusions extend in the thickness direction and deform under compression to conform to surface irregularities, effectively adding a third dimension to the contact interface. This dimensional change allows the heat transfer plate to bridge gaps and accommodate roughness on both mating surfaces, significantly reducing thermal contact resistance while maintaining reliable thermal connection.
Solution Approach 2:
The invention changes the physical state and mechanical properties of the heat transfer medium by using a compressible 3D plate structure instead of thin 2D sheets or pastes. The contact protrusions are designed with specific elasticity and deformability parameters that allow them to compress and conform under assembly pressure. This parameter change enables the heat transfer plate to adapt to varying surface conditions and maintain optimal contact pressure distribution, thereby reducing thermal resistance.
2Reliability
If heat conducting materials are used to compensate for tolerances, then contact surface coverage improves, but the thermal conductivity decreases compared to direct metal-to-metal contact
Solution Approach 1:
By introducing 3D contact protrusions that extend through the thickness of the plate, the invention achieves comprehensive surface coverage without relying on thin 2D materials. The protrusions can deform to contact all high spots on irregular surfaces, ensuring complete coverage while maintaining a bulk 3D structure with superior thermal conductivity pathways compared to conventional thin sheets or pastes.
Solution Approach 2:
The heat transfer plate is made from high thermal conductivity materials such as copper or aluminum alloys, combining the benefits of metal-to-metal contact thermal conductivity with the compliance needed for surface coverage. This composite approach integrates the structural integrity and thermal performance of metals with the adaptability needed to compensate for manufacturing tolerances and surface irregularities.
3Volume of moving object
If the power module size is reduced, then space efficiency improves, but the heat dissipation capability per unit area decreases
Solution Approach 1:
The heat transfer plate features localized contact protrusions concentrated at the heat transfer interface, providing enhanced contact quality precisely where needed for heat dissipation. This local quality enhancement ensures optimal thermal coupling between the power module and cooling device, maximizing heat transfer efficiency within the limited space of compact power modules.
Solution Approach 2:
The 3D contact protrusions extend in the thickness direction to create multiple contact points and increased contact surface area within the limited lateral dimensions of compact power modules. This vertical dimension exploitation allows effective heat dissipation from small footprint modules by maximizing the thermal interface area without increasing the module's planar footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3-dimensional heat transfer plate effectively dissipates heat by maximizing contact surface area and compensating for surface irregularities, improving thermal conductivity and reducing thermal resistance in compact electronic power units.
Implementation Method 1
the contact protrusions are deformed in the direction of the plate plane. In the ideal case, the contact protrusions are pushed into the plate plane such a distance that a 2-dimensional plate remains between the two surfaces in the braced state and the entire surface of this 2-dimensional plate is in contact with the component that is to be cooled and the cooling device
Implementation Method 2
The thermal conductivity of heat conducting sheets or heat conducting pastes is in the range of 0.3 to 5 W/mK. The thermal conductivity of solder after hardening is in the range of 20 to 50 W/mK.
Data Source
AI summary
The invention relates to a method for producing an assembly (1), in particular a power electronics unit, comprising the following steps: providing a component (2) to be cooled having a first surface (4), providing a cooling device (3) having a second surface (5) opposite the first surface (4), arranging a 3-dimensional heat transfer plate (6) between the two surfaces (4, 5), wherein the heat transfer plate (6) extends in a plate plane (11) parallel to the two surfaces (4, 5) and in the initial state a plurality of contact extensions (9) which extend outwards with respect to said plate plane (11), and bracing the component (2) and the cooling device (3) relative to one another, such that the contact extensions (9) are deformed in the direction of the metal sheet.