3D IC Contactless Power and Heat Management
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Solution Overview
Problem
3D IC packages face challenges in heat dissipation and power delivery due to the area used by through-silicon-vias (TSV) and the thermally insulating nature of semiconductor die materials, which limits the available space for operational devices and complicates heat spreader implementation, especially in stacked configurations with multiple dies.
Innovation Solution
The implementation of a 3D IC packaging technique that uses contactless chip-to-chip signal and power communication, eliminating the need for TSVs by employing conductive pillars and substrates with conductive traces for power and heat dissipation, and incorporating inductors with ferromagnetic material for enhanced wireless communication, allowing for efficient power delivery and heat management without the need for physical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If through-silicon-vias (TSV) are used for power and signal communication between stacked ICs, then vertical integration density is improved, but the area available for operational devices is reduced
Solution Approach 1:
The patent segments the power and signal communication function from the vertical stacking structure by introducing contactless communication between dies. This allows the TSV area to be reduced or eliminated, freeing up chip area for operational devices while maintaining vertical integration through wireless communication channels.
Solution Approach 2:
The patent replaces the mechanical/physical connection system (TSVs providing electrical contact) with a contactless communication system using electromagnetic fields. This substitution eliminates the need for through-silicon-vias to carry power and signals, thereby preserving chip area for operational devices while achieving vertical integration.
2Volume of moving object
If three or more dies are stacked vertically, then space efficiency is improved, but heat dissipation becomes more difficult due to thermally insulating die materials
Solution Approach 1:
The patent extracts the heat dissipation function from the die stack interior by enabling contactless communication that allows heat to be managed externally. The contactless communication system permits thermal management solutions to be applied to individual dies or groups of dies without being constrained by the need for internal thermal pathways through multiple stacked layers.
Solution Approach 2:
The patent introduces an intermediary field (electromagnetic field for contactless communication) that allows power and signal transmission without requiring direct physical contact between dies. This intermediary approach decouples the thermal management challenge from the communication function, allowing independent optimization of heat dissipation pathways.
3Temperature
If a large heat spreader is provided on interior dies, then heat dissipation is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent inverts the conventional approach by implementing heat dissipation solutions on exterior dies rather than interior dies. The contactless communication system enables thermal management to be applied from the outside of the stack, allowing heat spreaders to be placed on accessible exterior surfaces where they can efficiently dissipate heat from multiple dies without requiring complex internal integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses the heat dissipation and power delivery challenges in 3D ICs by reducing the need for TSVs, improving thermal management, and eliminating microbump-related issues during testing, while maintaining efficient power and signal transmission between stacked dies.
Implementation Method 1
incorporating inductors with ferromagnetic material for enhanced wireless communication
Implementation Method 2
incorporating inductors with ferromagnetic material for enhanced wireless communication
Implementation Method 3
The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies
Implementation Method 4
The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies
Implementation Method 5
At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die
Implementation Method 6
At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die
Data Source
AI summary
A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.