3D IC Coolant Channels for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Three-dimensional integrated circuits face significant thermal management challenges due to increased chip heat loads and longer thermal path lengths, which hinder efficient heat dissipation as chip density and power generation increase, especially beyond the 65 nm node.
Innovation Solution
The implementation of a structure and method for thermal management in 3D ICs, where substrates with circuit elements are bonded together with coolant channels formed between them, allowing a fluid to flow through these channels for effective heat dissipation, leveraging existing FEOL and BEOL processing and bonding technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D integration is implemented to reduce interconnect delays and increase density, then chip performance and volumetric density are improved, but thermal management becomes more difficult due to increased heat loads and longer thermal path lengths
Solution Approach 1:
The patent transitions from traditional 2D heat dissipation to 3D thermal management by implementing coolant channels that flow vertically through the stacked substrates. This dimensional change allows heat to be removed from internal layers of the 3D stack, addressing the thermal management challenges created by increased chip density and power generation in 3D integration.
Solution Approach 2:
The patent divides the thermal management system into multiple segmented coolant channels, each serving specific substrate layers. The cooling system is partitioned with separate channels for different regions and depths, allowing targeted heat removal from high-density areas while maintaining flexibility in thermal control across the stacked structure.
2Productivity
If chip density and power generation increase beyond 65 nm node, then circuit functionality and performance are enhanced, but heat dissipation efficiency deteriorates due to longer thermal path lengths
Solution Approach 1:
The patent introduces coolant channels as intermediary thermal pathways between the heat-generating circuit elements and the external cooling system. These channels act as mediators that conduct heat away from the dense circuit regions through direct fluid contact, bypassing the limitations of conventional conduction-based heat dissipation and restoring efficient energy removal.
Solution Approach 2:
The patent employs hydraulic cooling by circulating fluid through channels formed between substrates. This hydraulic approach enables active heat transport via flowing coolant, providing superior heat dissipation efficiency compared to passive conduction methods, especially for high-power density applications beyond 65 nm node where traditional thermal paths become insufficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency by reducing thermal resistance and achieving a more uniform temperature distribution across the circuit stack, improving performance and reliability by targeting high heat-generating areas with optimized coolant channel design.
Implementation Method 1
a coolant channel formed in the space between the first and second substrates such that a fluid entering the entrance through-hole transits the coolant channel and the exit through-hole to provide cooling to the circuit element
Implementation Method 2
first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element
Data Source
AI summary
A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate, forms in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate, forms respective bonding elements on at least one of the first and second substrates, and bonds the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel in between the first and second substrates.