3D IC MIM Capacitor Layout for Early Power Path Decoupling
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Solution Overview
Problem
Existing decoupling capacitors in 3D IC devices are not effectively utilized, leading to unfiltered or minimally filtered signals due to certain signal lines bypassing the capacitors, resulting in noise, voltage bias fluctuation, and current resistance issues.
Innovation Solution
Integrate multi-layer MIM capacitors closer to the input power signals in 3D IC structures, forming them along power signal paths to ensure coupling before reaching the devices, and incorporate region-specific capacitors to filter signals specific to top or bottom devices or between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If decoupling capacitors are integrated in 3D IC devices, then capacitance density is improved, but signal filtering effectiveness deteriorates because certain signal lines bypass the capacitors
Solution Approach 1:
The patent implements different interconnect structures for different signal paths. Power signal lines are routed through the MIM capacitor to enable filtering, while other signal lines maintain direct connections. This local differentiation ensures that capacitors effectively filter power signals without impeding other signal paths, resolving the contradiction between high capacitance density and effective signal filtering.
2Device complexity
If MIM capacitors are positioned away from input power signals, then device complexity is reduced, but noise filtering and voltage stabilization effectiveness deteriorate
Solution Approach 1:
The MIM capacitors are positioned and connected to intercept power signals early in their path, before the signals reach the devices. This preliminary filtering action removes noise and stabilizes voltage at the source, preventing harmful fluctuations from propagating through the system. The capacitors are strategically placed in the power distribution network to maximize their filtering effectiveness while maintaining manageable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively filters noise and decouples current spikes, voltage bias fluctuations, and resistance drops by ensuring MIM capacitors are positioned to intercept signals early in their path, improving signal quality and device performance.
Implementation Method 1
forming metal-insulator-metal (MIM) capacitor structures in the IC passivation layer
Data Source
AI summary
One aspect of the present disclosure pertains to a method. The method includes receiving a first circuit structure having semiconductor devices, an interconnect structure, first feedthrough vias, top metal lines, redistribution vias, and bond pads. The method includes dicing the first circuit structure to form a top die having a top semiconductor device. The method includes forming a stacked integrated circuit (IC) structure by bonding the top die to a second circuit structure, the second circuit structure having second semiconductor devices, a second interconnect structure, second redistribution vias, and second bond pads. The method includes forming IC top metal lines over the first feedthrough vias, forming an IC passivation layer over the IC top metal lines, forming metal-insulator-metal (MIM) capacitor structures in the IC passivation layer, and forming IC redistribution vias penetrating through the MIM capacitor structures and the IC passivation layer to land on the IC top metal lines.