3D IC Optical Transceiver Interlayer Communication
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Solution Overview
Problem
In three-dimensional (3D) integrated circuits, communication between multiple layers typically relies on pins such as interlayer vias or through silicon vias, which are inefficient due to misalignment and larger area requirements, leading to increased complexity and size penalties.
Innovation Solution
The use of optical transceivers and serializers/deserializers in a 3D IC structure allows for data transmission through modulated light signals between layers, reducing the need for physical pins and achieving alignment through optical signal alignment, thereby eliminating the need for interlayer vias or through silicon vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interlayer vias or through silicon vias are used for communication between layers, then data transmission is achieved, but misalignment and larger area requirements occur
Solution Approach 1:
The patent replaces mechanical/electrical pin-based communication (interlayer vias, through silicon vias) with optical communication using light transceivers. This substitution eliminates the need for precise mechanical alignment of vias between layers and reduces the area required for connection structures, as optical signals can be directed more compactly than electrical signals through vias.
Solution Approach 2:
The patent introduces light transceivers as intermediary components that convert electrical signals to optical signals for interlayer communication. These transceivers act as mediators between layers, allowing data transmission without direct electrical connections through vias, thereby eliminating alignment issues and reducing area requirements for connection structures.
2Productivity
If pins are used for interlayer communication, then data transmission is achieved, but complexity and size penalties increase
Solution Approach 1:
The patent replaces the complex mechanical pin and via structure with optical transceivers that use light to transmit data between layers. This substitution simplifies the overall structure by eliminating the need for multiple pin types (interlayer vias, through silicon vias) and their associated alignment and fabrication complexities.
Solution Approach 2:
The light transceiver components serve multiple functions: they transmit data between layers, provide alignment tolerance, and reduce structural complexity. By using a single optical communication infrastructure, the system achieves universal interlayer communication without requiring different via types or complex pin arrangements for different communication needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of required pins, minimizes misalignment issues, and decreases the area penalty, enhancing communication efficiency and integration density in 3D IC structures by using optical signals to transmit data between layers.
Implementation Method 1
data transmission through modulated light signals between layers
Data Source
AI summary
A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.