3D IC Power Distribution Structure for Lower Resistance Paths
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Solution Overview
Problem
Existing IC packages lack efficient power distribution structures that can reduce power distribution path resistance and enhance arrangement flexibility, particularly when integrating multiple dies in 3D IC configurations.
Innovation Solution
The integration of a power distribution structure electrically connected to the back side power distribution structures of each die in IC packages, allowing for lower resistance paths and greater flexibility in die arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional power distribution structures are used in IC packages, then the structure is simpler and easier to manufacture, but the power distribution path resistance is higher and arrangement flexibility is limited
Solution Approach 1:
The patent transitions from traditional planar power distribution to a three-dimensional stacked configuration where power distribution structures are positioned on both front and back sides of dies, connected through vertical interconnects. This dimensional change enables lower resistance paths by providing multiple parallel power distribution routes and reducing current density in any single path.
Solution Approach 2:
The power distribution structure is segmented into multiple independent components: front side power distribution structures, back side power distribution structures, and interconnecting vertical structures. This segmentation allows each component to be optimized independently and provides multiple parallel paths for power distribution, reducing overall resistance.
2Adaptability or versatility
If traditional power distribution structures are used in IC packages, then the manufacturing process is simpler, but the arrangement flexibility of multiple dies is reduced
Solution Approach 1:
The power distribution structures are designed with universal interfaces and standardized configurations on both front and back sides of dies. This multi-functionality allows the same structural patterns to be reused across different die arrangements and package configurations, enhancing adaptability while maintaining manufacturing efficiency through pattern repetition.
Solution Approach 2:
By adding vertical stacking of power distribution structures across multiple die layers, the system gains arrangement flexibility without complicating the lateral manufacturing processes. The vertical dimension provides additional degrees of freedom for die placement and package design.
3Power
If power distribution structures are added to reduce resistance, then power delivery efficiency improves, but the device complexity increases
Solution Approach 1:
The patent merges power distribution functions across front and back sides of dies, combining multiple power delivery paths into a unified three-dimensional network. This merging provides redundant parallel paths that improve power delivery efficiency and reliability while distributing the complexity across multiple integrated components rather than adding isolated complex elements.
Data Source
AI summary
An IC package includes a first die including a front side and a back side, the front side including a first signal routing structure, the back side including a first power distribution structure, and a second die including a front side and a back side, the front side including a second signal routing structure, the back side including a second power distribution structure. The IC package includes a third power distribution structure positioned between the first and second power distribution structures and electrically connected to each of the first and second power distribution structures.