3D IC Thermal Pad Embedded in Adhesive Layer
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Solution Overview
Problem
Three-dimensional integrated circuits face heat dissipation challenges due to the low thermal conductivity of adhesive bonding layers and the limited effectiveness of current thermal TSVs, leading to increased working temperatures and reduced reliability, especially in portable electronic devices.
Innovation Solution
Incorporating an inter-stratum thermal pad with high thermal conductivity, such as copper, embedded within the adhesive bonding layer to directly face the hot zone and enhance heat dissipation, along with thermal vias to facilitate heat transmission through both vertical and horizontal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonding layer is used to fix chips together, then chips can be bonded and formed into three-dimensional structure, but thermal conductivity is low and heat dissipation efficiency is reduced
Solution Approach 1:
The adhesive bonding layer is constructed as a composite structure comprising a first adhesive layer and a second adhesive layer with different materials and properties. The first adhesive layer provides bonding strength while the second adhesive layer with higher thermal conductivity (such as metal-based adhesive) improves heat dissipation efficiency. This composite approach allows simultaneous achievement of strong bonding and effective thermal management.
2Temperature
If thermal TSV is configured beside the hot zone, then some heat dissipation is achieved, but heat dissipation effectiveness is very limited
Solution Approach 1:
A thermal interface layer is introduced as an intermediary component between the chip and the substrate. This thermal interface layer serves as a dedicated heat transfer pathway that directly conducts heat away from the hot zone to the substrate, significantly improving heat dissipation effectiveness without requiring complex thermal TSV configurations beside the hot zone.
3Temperature
If microchannel cooling is used to dissipate heat, then heat dissipation capability is improved, but structure becomes larger and not suitable for portable devices
Solution Approach 1:
The heat dissipation function is extracted and integrated directly into the adhesive bonding layer itself, rather than adding separate cooling structures like microchannels. By incorporating thermally conductive materials and thermal management features within the existing bonding layer, effective heat dissipation is achieved without increasing device volume, making it suitable for portable electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation efficiency of three-dimensional integrated circuits by preventing heat blockage and increasing thermal conductivity, thereby reducing operating temperatures and enhancing reliability.
Implementation Method 1
The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone. a material of the inter-stratum thermal pad is a material that has a high coefficient of thermal conductivity
Implementation Method 2
at least one first thermal via. Each first thermal via penetrates the first adhesive bonding layer and the second chip and is located in a portion of the inter-stratum thermal pad
Data Source
AI summary
A three-dimensional integrated circuit, including a first adhesive bonding layer, a first chip, a second chip, and an inter-stratum thermal pad, is provided. The first adhesive bonding layer has a first surface and a second surface opposite to each other. The first chip is disposed on the first surface of the first adhesive bonding layer. The first chip includes a hot zone. The second chip is disposed on the second surface of the first adhesive bonding layer. The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone.