3D IC Package Thermal Vias for Dense Die Heat Dissipation
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Solution Overview
Problem
The challenge of overheating in IC packages due to insufficient thermal management, leading to device failure and electrical performance deterioration, particularly in densely packed electronic components with limited space for cooling.
Innovation Solution
Integration of a temperature control element within the IC die, featuring a substrate with vias filled with heat dissipation materials like conductive, ceramic, or metal-ceramic composites, and varying pitch densities to enhance thermal dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC components are densely packed to increase capacity and performance, then productivity and device capability are improved, but thermal management becomes insufficient leading to overheating
Solution Approach 1:
The patent introduces a vertical temperature control element that extends through the substrate thickness, transforming the traditional planar heat dissipation approach into a three-dimensional structure. This allows heat to be conducted away from densely packed devices through the substrate thickness direction, providing an additional thermal management dimension that does not interfere with horizontal component density.
Solution Approach 2:
The temperature control element acts as a thermal intermediary between the densely packed IC devices and the heat sink. It provides a dedicated thermal conduction path through the substrate, mediating heat transfer without requiring direct contact between devices and external cooling structures, thus maintaining device density while improving thermal management.
2Temperature
If space for cooling structures is increased to improve thermal management, then temperature control is improved, but device density and capacity are reduced
Solution Approach 1:
The temperature control element is merged with the substrate structure itself, integrating thermal management functionality into the existing IC package substrate. This eliminates the need for separate external cooling structures that would occupy valuable space, as the substrate simultaneously serves as both the device mounting platform and the thermal conduction pathway.
Solution Approach 2:
The substrate is designed to serve multiple functions: mechanical support for IC devices, electrical interconnection pathway, and thermal conduction structure. The temperature control element embedded in the substrate provides thermal management functionality without requiring additional dedicated space, as it utilizes the substrate's existing structural volume.
3Ease of manufacture
If traditional cooling structures are used in IC packages, then manufacturing is simpler, but thermal dissipation efficiency is insufficient for high-density devices
Solution Approach 1:
The patent modifies the substrate's thermal parameters by embedding a temperature control element with superior thermal conductivity properties. This changes the overall thermal conduction capability of the substrate from conventional levels to enhanced levels, improving heat dissipation efficiency without fundamentally altering the manufacturing process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation efficiency, preventing overheating and ensuring reliable operation of IC packages by effectively managing heat generated by densely packed electronic components.
Implementation Method 1
A heat dissipation material is disposed in the vias in the base structure. The heat dissipation material includes at least one of conductive materials, ceramic materials, metal-ceramic composite materials, metal alloy materials, semiconductor materials, graphite, diamond, or organic materials.
Data Source
AI summary
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.