3D IC Die Thermal Vias for Compact Package Cooling
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Solution Overview
Problem
The challenge in electronic devices is the limited cooling efficiency of chip assemblies due to space constraints, leading to overheating and potential device failure or performance deterioration.
Innovation Solution
Incorporating a temperature control element as an integral part of the IC die, which includes a heat dissipation material in vias within a silicon base structure, to enhance thermal dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If space constraints are imposed on IC package to reduce device size, then device compactness is improved, but cooling efficiency deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by forming vias (vertical channels) through the substrate thickness. This vertical dimension allows heat to escape from the backside of the IC die, effectively utilizing the third dimension (depth) to increase heat dissipation surface area without increasing the footprint area, thus resolving the contradiction between compact device size and cooling efficiency.
Solution Approach 2:
The substrate is designed with a porous structure containing multiple vias filled with heat dissipation material. This porous configuration increases the effective heat dissipation surface area within the limited substrate volume, allowing enhanced thermal management without increasing overall device size. The porous structure provides multiple heat conduction pathways while maintaining compact form factor.
2Productivity
If IC dies are placed closer together to increase density, then productivity is improved, but thermal management becomes more difficult
Solution Approach 1:
By implementing vertical vias through the substrate, the patent enables heat dissipation in the depth direction, allowing closely spaced IC dies to each have dedicated vertical heat escape routes. This three-dimensional heat management approach prevents thermal interference between adjacent dies while maintaining high density packaging.
Solution Approach 2:
The substrate is segmented into multiple regions with individually controlled vias and heat dissipation materials. Each IC die region has its own dedicated heat dissipation pathways through the substrate, allowing independent thermal management for each die even when densely packed, thus preventing heat accumulation and thermal coupling between adjacent devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a temperature control element with heat dissipation materials in the IC die significantly improves thermal management and cooling efficiency, preventing overheating and ensuring reliable device operation.
Implementation Method 1
A heat dissipation material is disposed in the vias in the base structure. The heat dissipation material includes at least one of ceramic materials, semiconductor materials, graphite, diamond, or organic materials.
Data Source
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AI summary
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.