3D IC Vertical Connector Repair via Multi-Level Signal Encoding
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Solution Overview
Problem
Conventional 3-D integrated circuit devices face challenges in efficiently repairing defective vertical connectors without consuming excessive die area and complicating signal routing, especially when the number of defective connectors exceeds the number of available repair connectors, and lack real-time 'on the fly' reconfiguration capabilities.
Innovation Solution
The implementation of a scheme that uses encoding/decoding circuits to encode multiple data bits into a multi-level signal, which can be transferred through a set of vertical connectors, allowing the decoding of the signal to bypass defective connectors without the need for redundant repair connectors, thus providing effective repair and reducing re-routing complexities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional repair schemes using redundant repair connectors are implemented, then defective vertical connectors can be replaced, but die area is consumed and re-routing complexities increase
Solution Approach 1:
The patent changes the signaling parameter from traditional single-bit per connector to multi-level voltage signals that can represent multiple bits simultaneously. This allows the same number of connectors to carry more data, effectively providing repair capability without adding redundant connectors by changing the electrical signal characteristics rather than the physical structure.
Solution Approach 2:
The patent merges multiple data streams into a single multi-level signal that can be transmitted through existing connectors. By combining redundancy and data transmission into the same signal pathway, the system achieves repair capability without requiring separate redundant connector structures, thus saving die area.
2Reliability
If conventional repair schemes using redundant repair connectors are implemented, then defective vertical connectors can be replaced, but signal routing complexity increases
Solution Approach 1:
By changing the signal parameter to multi-level voltages, the patent enables a single connector to carry multiple bits of information including redundancy bits. This eliminates the need for complex re-routing of multiple separate signal paths that would be required in conventional redundancy schemes, thereby reducing signal routing complexity.
Solution Approach 2:
The existing vertical connectors are made multi-functional by enabling them to carry both data and redundancy information simultaneously through multi-level signaling. This universal approach allows the same physical infrastructure to handle both normal operation and repair scenarios without requiring additional dedicated repair routing paths.
3Reliability
If multi-level signaling is used to bypass defective connectors, then repair capability is achieved without redundant connectors, but signal encoding/decoding complexity increases
Solution Approach 1:
The patent applies error detection and correction codes preliminarily to the data before transmission through the connectors. This preliminary encoding allows the receiving end to detect and correct errors without requiring complex real-time decoding during operation, thereby managing encoding/decoding complexity through advance preparation of the data signal.
Solution Approach 2:
The patent introduces intermediary encoding/decoding circuits that translate between the multi-level signals and standard logic levels. These intermediary circuits handle the complexity of multi-level signal interpretation, isolating the main system from direct complexity while enabling defective connector bypass through the multi-level signaling mechanism.
Data Source
AI summary
Apparatus are disclosed, such as those involving a 3-D integrated circuit. One such apparatus includes a first die including a plurality of vertical connectors formed therethrough. The apparatus also includes a first circuit configured to encode multiple data bits into a multi-bit symbol, and provide the multi-bit symbol to two or more of the vertical connectors. The apparatus further includes a second circuit configured to receive the multi-bit symbol from at least one of the two or more vertical connectors, and decode the multi-bit symbol into the multiple data bits. The apparatus provides enhanced repairability with no or less redundant vertical connectors, thus avoiding the need for “on the fly” or field repair of defective vertical connectors.