3D IC Package Thermal Via Layout for Dense Die Cooling
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Solution Overview
Problem
The challenge in electronic devices is the inefficiency in thermal management of IC dies due to space constraints, leading to overheating and potential device failure or performance deterioration.
Innovation Solution
Incorporating a temperature control element as an integral part of the IC die, featuring a substrate with a heat dissipation material in vias, which enhances thermal dissipation efficiency by distributing heat dissipation materials like conductive, ceramic, or metal-ceramic composite materials across the substrate, tailored to accommodate different thermal energy generation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If space constraints are imposed on IC package layout, then device density increases, but thermal dissipation efficiency deteriorates
Solution Approach 1:
The temperature control element is segmented into multiple vias distributed across the substrate, with different pitch densities in different regions. This segmentation allows heat to be dissipated through multiple localized pathways, improving thermal management in high-density device layouts where space for conventional cooling solutions is limited.
Solution Approach 2:
The via pitch density is varied locally across the substrate - higher density in regions with greater thermal energy generation and lower density in regions with lesser thermal generation. This local quality adjustment optimizes thermal dissipation efficiency at each specific location, addressing the thermal management challenge in space-constrained IC packages.
2Temperature
If conventional cooling solutions are used, then thermal management is provided, but space constraints are exacerbated
Solution Approach 1:
The temperature control element is merged with the IC die substrate itself, making the substrate serve dual functions as both the device platform and the thermal management structure. This integration eliminates the need for separate cooling components, providing effective thermal management while preserving宝贵的 package space for other devices and interconnects.
Solution Approach 2:
The substrate is given multi-functionality by incorporating the temperature control element directly into it. The substrate simultaneously supports the electronic devices and provides thermal dissipation pathways through the integrated vias, reducing the overall space requirement in the IC package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves the thermal dissipation efficiency of IC packages, preventing overheating and ensuring reliable operation by integrating a temperature control element within the IC die, suitable for various device layouts and thermal demands.
Implementation Method 1
A heat dissipation material is disposed in the vias in the base structure. The heat dissipation material includes at least one of conductive materials, ceramic materials, metal-ceramic composite materials, metal alloy materials, semiconductor materials, graphite, diamond, or organic materials.
Data Source
AI summary
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.