3D Imaging System Using Frequency Sweep Modulation
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Solution Overview
Problem
Current mobile phone cameras are limited to capturing only 2D images, lacking the capability to take high resolution 3D images with depth information, which is desirable for various applications such as medical imaging, robotics, and gesture recognition.
Innovation Solution
A system and method for three-dimensional imaging integrated into a mobile phone, utilizing a light source, modulator, optical circuitry, light sensor circuitry, and signal processing circuit to split, modulate, and analyze optical signals for extracting 3D information, with components such as light splitters, couplers, and a silicon photonic chip for image processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional 2D camera is used in a mobile phone, then the device complexity is low and ease of operation is maintained, but the imaging capability is limited to 2D images without depth information
Solution Approach 1:
The system divides the imaging function into separate modules: a light source module for emitting light, an optical circuitry module for optical processing, and a light sensor circuitry module for detection. This segmentation allows each module to be optimized independently while working together to achieve 3D imaging capability without overwhelming complexity
Solution Approach 2:
The patent integrates multiple functional components within a compact structure, nesting the optical circuitry and light sensor circuitry within the mobile phone housing. The optical circuitry includes nested components such as light splitters, couplers, and combiners that are arranged to minimize space while maximizing functionality
2Measurement precision
If optical circuitry with multiple light splitters and couplers is used, then the measurement precision for 3D information extraction is improved, but the device complexity increases
Solution Approach 1:
The optical circuitry is designed so that the light source serves multiple functions: illuminating the object, providing reference light for interferometry, and enabling depth measurement. The light sensor circuitry similarly performs both image capture and depth information extraction, reducing the need for separate dedicated components for each function
Solution Approach 2:
The patent introduces optical interferometry as an intermediary mechanism between the light source and light sensor. This interferometric approach allows precise measurement of optical path differences that correspond to depth information, providing high measurement precision through a well-established physical principle rather than complex direct measurement systems
3Productivity
If high resolution 3D imaging is implemented, then the productivity and functionality for structural analysis are improved, but the ease of operation may be compromised
Solution Approach 1:
The system automatically processes the optical signals and extracts 3D information without requiring manual intervention. The signal processing circuitry autonomously analyzes the interferometric patterns and converts them into depth maps and 3D models, maintaining ease of operation while achieving high productivity in 3D image generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the capture of high resolution 3D images with depth information, enhancing the functionality of mobile phones for applications requiring structural analysis and evaluation, while maintaining a user-friendly interface similar to regular mobile phones.
Implementation Method 1
a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal
Implementation Method 2
a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals
Data Source
AI summary
A system for three dimensional imaging includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical circuitry connected to the light source; a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals; and a signal processing circuit connected with the light sensor circuitry and configured to extract 3D information of the object from the electrical signals. A mobile phone having the system and a method for three dimensional imaging are also provided.