3D Inductor-Capacitor Circuit for 5G RF Filter Q-Factor
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Solution Overview
Problem
Conventional inductor-capacitor (LC) circuits in 5G wireless communication systems have a low quality factor (Q-factor) due to current crowding, which degrades the performance of radio frequency (RF) filters, necessitating an improvement to achieve higher spectral efficiency.
Innovation Solution
A three-dimensional (3D) LC circuit is designed with a conductive ribbon of defined height and a conductive sleeve, generating built-in capacitance and distributing electrical current across the ribbon's height to reduce current crowding and enhance the Q-factor, eliminating the need for external capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a planar inductor is used in a conventional LC circuit, then the device complexity is reduced, but the quality factor (Q-factor) deteriorates due to current crowding
Solution Approach 1:
The patent transitions from a two-dimensional planar inductor to a three-dimensional inductor structure. The conductive ribbon is configured with a defined height extending in the vertical dimension, and the conductive sleeve wraps around the ribbon, creating a 3D configuration. This dimensional change allows current to distribute across the height of the ribbon, reducing current crowding and improving the Q-factor while maintaining manufacturing feasibility through standard semiconductor processing techniques.
2Reliability
If the height of the conductive ribbon is increased to reduce skin effect, then the Q-factor is improved, but the manufacturing precision requirements worsen
Solution Approach 1:
The conductive sleeve is designed to wrap around and enclose the conductive ribbon, creating a nested configuration where the ribbon is positioned within the sleeve structure. This nesting provides mechanical support and alignment for the ribbon, ensuring consistent height and positioning without requiring extremely tight manufacturing tolerances for the ribbon itself. The sleeve acts as a structural framework that maintains the geometric parameters necessary for optimal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D LC circuit achieves a high Q-factor, enabling the formation of high-performance RF filters for 5G wireless communication systems with improved spectral efficiency and reduced resistance.
Implementation Method 1
the conductive sleeve and the conductive ribbon can generate a built-in capacitance(s) for the 3D LC circuit
Implementation Method 2
the conductive ribbon can also help reduce a skin effect of the inductor by distributing an electrical current across the defined height of the conductive ribbon
Data Source
AI summary
Embodiments of the disclosure relate to a three-dimensional (3D) inductor-capacitor (LC) circuit. The 3D LC circuit includes an inductor formed by a conductive ribbon of a defined height and a conductive sleeve conductively coupled to the conductive ribbon. The conductive sleeve and the conductive ribbon can generate a built-in capacitance(s) for the 3D LC circuit. In examples discussed herein, the conductive ribbon can also help reduce the skin effect of the inductor by distributing an electrical current across the defined height of the conductive ribbon. By generating the built-in capacitance(s) and distributing the electrical current across the defined height of the conductive ribbon, it is possible to reduce current crowding and improve quality factor (Q-factor) of the 3D LC circuit. As a result, it is possible to couple one or more 3D LC circuits to form a high performance radio frequency (RF) filter(s) for the fifth-generation (5G) wireless communication systems.