3D Integrated Inductor-Capacitor Structure for High Q Factor
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Solution Overview
Problem
Existing semiconductor manufacturing technologies face challenges in achieving high inductance values and quality factor Q for integrated inductors due to eddy currents in substrates, leading to increased energy loss and production costs, as planar structures are limited in enhancing magnetic flux and reducing eddy currents.
Innovation Solution
A method for preparing a three-dimensional integrated inductor-capacitor structure involves sequential deposition and etching of insulating and metal layers to form interconnected metal wires and magnetic cores, creating a three-dimensional spiral inductor that increases inductance magnetic flux and reduces eddy currents, thereby improving the quality factor Q and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar structure integrated inductors are used, then manufacturing is simpler, but eddy currents form in the substrate at high frequencies causing decreased quality factor Q
Solution Approach 1:
The patent transitions from a planar two-dimensional inductor structure to a three-dimensional vertical structure. The inductor coil is formed with multiple metal layers stacked vertically, with conductive vias connecting the layers. This three-dimensional configuration increases the inductance magnetic flux by creating a larger effective loop area while reducing eddy currents in the substrate, thereby improving the quality factor Q while maintaining manufacturability through standard semiconductor fabrication processes.
2Ease of manufacture
If planar structure integrated inductors are used, then manufacturing is simpler, but inductance value cannot be increased due to limitations of manufacture procedure and materials
Solution Approach 1:
The patent employs a three-dimensional vertical inductor structure with multiple stacked metal layers to increase the inductance value. By stacking conductive layers vertically and connecting them through vias, the effective inductance area is expanded without increasing the lateral footprint. This approach overcomes the limitations of planar structures where inductance value is constrained by available substrate area and material properties, enabling higher inductance values while using standard semiconductor manufacturing processes.
3Reliability
If circuit configuration with both inductor and capacitor is used, then performance requirements are met, but area of the device increases and production costs increase
Solution Approach 1:
The patent integrates both inductor and capacitor functions into a single three-dimensional structure. The inductor coil is formed using stacked metal layers, and capacitor elements are incorporated within the same vertical structure by creating capacitive regions between adjacent metal layers or between metal layers and the substrate. This merged inductor-capacitor structure satisfies performance requirements for both components while occupying significantly less device area compared to separate planar implementations, thereby reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for increased inductance values and reduced eddy currents, enhancing the quality factor Q and performance of inductance coils while minimizing production costs by achieving capacitance and inductance in a smaller space.
Implementation Method 1
increases the inductance magnetic flux in order to increase the inductance value
Implementation Method 2
Filling second metal in said second through hole and annular grooves to form second metal interconnections and a number of annular magnetic cores on each of said first metal interconnections
Implementation Method 3
eddy current may form in the substrate at high frequencies, and the direction of the eddy current is opposite to the direction of the current in the inductance coil
Data Source
AI summary
The invention relates to a field of semiconductor manufacturing technology, more particularly, to a method for preparing three-dimensional integrated inductor-capacitor structure, which can realize the inductor-capacitor of three-dimensional structure, and form three-dimensional spiral inductor centering on the magnetic cores of single direction around through the preparation of the interconnected top metal conducting wires and bottom metal conducting wires, which can gain capacitance and inductance at the same time in a relatively small space, and reduce the production costs, and also greatly improves the inductance magnetic flux in order to increase the inductance value and reduce eddy current, and improve the quality factor Q value and the performance of inductance coil.