3D Inductor Coil Encapsulation for PCB Space Optimization
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Solution Overview
Problem
Large inductors in electronic circuits limit flexibility and design options for printed circuit board layouts and packaging due to their size, restricting the use of space and potentially interfering with other circuit components.
Innovation Solution
Positioning an inductor coil above the circuit components on a circuit board and encapsulating it, along with the components and part of the board surface, in a magnetic material to enhance inductance and act as an EMI shield, while also providing thermal conductivity and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large inductor is used to achieve required inductance, then inductance performance is improved, but the space occupied by the inductor increases and limits PCB layout flexibility
Solution Approach 1:
The patent transitions the inductor from a planar PCB-mounted component to a three-dimensional structure positioned above the circuit board. The coil is suspended in space and encapsulated with magnetic material, utilizing vertical space rather than horizontal PCB area, thereby achieving high inductance without increasing PCB footprint.
Solution Approach 2:
The patent uses composite construction by combining the coil structure with magnetic material encapsulation. The magnetic material (such as ferrite or magnetizable polymer) is integrated with the coil to form a composite inductor assembly, enhancing the magnetic field and inductance performance while maintaining compact dimensions.
2Ease of manufacture
If inductor is mounted on circuit board, then ease of assembly is improved, but available space for other components is reduced
Solution Approach 1:
The inductor is positioned in the vertical dimension above the circuit board rather than being mounted on the board surface. This spatial reconfiguration allows the PCB to maintain its full planar area for other components while the inductor occupies unused vertical space, effectively adding a third dimension to the layout.
3Device complexity
If traditional inductor mounting is used, then manufacturing simplicity is maintained, but thermal management and EMI shielding are insufficient
Solution Approach 1:
The magnetic material encapsulation serves multiple functions simultaneously: it shields stray magnetic fields (reducing EMI), provides thermal conduction paths for heat dissipation, and offers mechanical support for the coil structure. This multi-functional composite approach addresses thermal management and EMI shielding without significantly complicating manufacturing.
Solution Approach 2:
The magnetic material encapsulation is designed to perform multiple functions: EMI shielding, thermal management, and mechanical support. This multi-functional element consolidates several required features into a single component, maintaining manufacturing simplicity while solving multiple problems simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a larger and more efficient inductor design, optimizing available space and reducing stray magnetic fields, while enhancing thermal management and mechanical support, thereby improving the overall performance and flexibility of electronic assemblies.
Implementation Method 1
encapsulating the inductor coil, the circuit component and at least part of the top surface of the circuit board in a magnetic material
Implementation Method 2
positioning an inductor coil above the circuit component
Implementation Method 3
providing thermal conductivity
Data Source
AI summary
Methods of making an assembly are disclosed. The assembly may include a circuit board with a top surface and a circuit component mounted on the top surface of the circuit board. The method may include positioning an inductor coil above the circuit component and the top surface of the circuit board and encapsulating the inductor coil, the circuit component and at least part of the top surface of the circuit board in a magnetic material. Assemblies according to such methods are also disclosed.