3D Inductor Nesting for Compact RF Circuit Design
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Solution Overview
Problem
There is a need for RF circuitry in wireless communications devices that is low cost, small, simple, flexible, and efficient to support multiple wireless communications protocols while minimizing size, cost, and power consumption.
Innovation Solution
The use of three-dimensional (3D) inductors with conductive paths shaped as 2D lobes laid over 3D volumes, allowing for weak or moderate magnetic coupling by inserting one 3D inductor into another, enabling efficient signal propagation and magnetic field generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional planar inductors are used in RF circuitry, then the device can be manufactured with standard processes, but the inductor size occupies excessive chip area and limits support for multiple protocols
Solution Approach 1:
The patent transitions from traditional planar (2D) inductor designs to three-dimensional (3D) inductor structures. The 3D inductors utilize vertical stacking and multi-layer configurations to achieve higher inductance values and better performance within a smaller footprint, enabling multiple protocol support without excessive chip area occupation
Solution Approach 2:
The patent employs nested configurations where 3D inductors are arranged in concentric or interlaced patterns. Inner inductors are positioned within or between outer inductors, allowing multiple inductive elements to coexist in a compact arrangement that supports multiple communication protocols while minimizing overall device size
2Adaptability or versatility
If multiple RF circuits are integrated to support different protocols, then protocol versatility is improved, but device complexity, size, and power consumption increase
Solution Approach 1:
The patent designs 3D inductors with universal characteristics that allow them to function effectively across multiple RF protocols. The multi-layer 3D structures provide optimized performance for different frequency ranges and protocol requirements, reducing the need for completely separate dedicated circuits for each protocol
Solution Approach 2:
The patent combines multiple inductive elements into integrated 3D structures that can serve multiple protocol functions. By merging inductor designs and using shared 3D inductive components, the overall circuit complexity is reduced while maintaining support for multiple wireless communication protocols
3Volume of moving object
If inductors are placed close together to reduce chip area, then device size is minimized, but magnetic coupling between inductors causes interference
Solution Approach 1:
The patent uses nested 3D inductor configurations where inductors are arranged in concentric layers or interlaced structures. This nesting approach allows inductors to be positioned very close together or even overlapping in the vertical dimension, minimizing chip area while the three-dimensional separation reduces magnetic coupling interference compared to planar arrangements
Solution Approach 2:
By transitioning to 3D inductor structures, the patent utilizes the vertical dimension to separate inductive elements that would be crowded in the planar domain. This vertical stacking and multi-layer arrangement reduces magnetic interference while maintaining compact footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in compact, cost-effective RF circuitry that supports multiple protocols with efficient signal propagation and reduced energy concentration, addressing the challenges of size, cost, and power consumption.
Implementation Method 1
a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume... the second conductive path at least partially extends through the first 3D volume... the 3D inductors may be weakly or moderately coupled
Data Source
AI summary
Embodiments of an apparatus are disclosed that includes a first three dimensional (3D) inductor and a second 3D inductor. The first three dimensional (3D) inductor has a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume. In addition, the second 3D inductor has a second conductive path, wherein the second 3D inductor is inserted into the first 3D inductor so that the second conductive path at least partially extends through the first 3D volume. Since second 3D inductor is inserted into the first 3D inductor, the 3D inductors may be coupled to one another. Depending on orientation and distances of structures provided by the 3D inductors, the 3D inductors may be weakly or moderately coupled.