3D Integrated Automotive Radar Substrate
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Solution Overview
Problem
Current automotive radar systems are bulky, expensive, and suffer from noise and sensitivity issues due to the large number of connections and transitions between RFICs and antennas, which deteriorate their performance.
Innovation Solution
A low-cost, compact radar system utilizing a three-dimensional RF assembly technique with a printed circuit board and multi-layer organic substrate, minimizing connections and transitions between antennas and chips, and incorporating a 3D radio frequency front end for adaptive beam control and beam steering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coaxial, microstrip, and waveguide connections are used between antennas and RFICs, then signal transmission is achieved, but noise increases and sensitivity deteriorates due to the large number of connections and transitions
Solution Approach 1:
The patent combines multiple connection types (coaxial, microstrip, waveguide) into a single integrated substrate integration waveguide (SIW) structure. This merging eliminates the need for separate connection components and reduces the number of transitions between different connection types, thereby reducing noise and improving sensitivity while maintaining signal transmission quality.
Solution Approach 2:
The substrate integration waveguide acts as an intermediary structure that directly connects the antenna to the RFIC without requiring intermediate connection components. This direct connection path eliminates multiple transitions and reduces the harmful effects of noise and signal loss associated with traditional multi-stage connections.
2Strength
If traditional packaging and support structures are used, then structural support is provided, but the radar system becomes bulky and expensive
Solution Approach 1:
The patent merges the packaging structure, support structure, and signal transmission path into a single substrate integration waveguide structure. This multi-functional integration eliminates the need for separate metallic packaging and support components, significantly reducing the overall radar system volume while maintaining structural integrity and support functions.
Solution Approach 2:
The substrate integration waveguide performs multiple functions simultaneously: it provides structural support, enables signal transmission, and serves as the packaging structure. This multi-functionality eliminates the need for separate dedicated components for each function, reducing the overall system size and cost.
3Ease of operation
If multiple connection transitions are used between RFIC and antenna, then signal routing is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple signal routing functions into a single substrate integration waveguide structure that can be manufactured using standard PCB techniques. This merging reduces the number of separate components and assembly steps required, significantly simplifying the manufacturing process and reducing costs while maintaining signal routing capabilities.
Data Source
AI summary
The invention is a low-cost, compact radar for adaptively forming beams and independently steering the beams to improve the noise and sensitivity of the radar. The radar includes a printed circuit board, a low-cost multi-layer organic substrate, and a three dimensional (3D) radio frequency (RF) front end that is flood mounted on the substrate.