3D Integrated Structure Lateral Encapsulation Cooling Channels
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Solution Overview
Problem
Existing three-dimensional integrated structures face challenges in heat dissipation due to the complexity of implementing cooling channels directly within the integrated circuits, which requires modifications to the structure.
Innovation Solution
The solution involves forming channels in a lateral encapsulation region surrounding the integrated circuits, using a resin-based encapsulation and a cap with serpentine channels to facilitate fluid circulation and thermal exchange, allowing for efficient heat dissipation without modifying the integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling channels are formed directly within the integrated circuits, then heat dissipation efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions the cooling channel location from the vertical dimension (within integrated circuit layers) to the lateral dimension (in the encapsulation region surrounding the circuits). This dimensional shift allows channels to be formed in the horizontal plane around the 3D stack, eliminating the need to modify the vertical IC structure while maintaining effective heat removal paths.
Solution Approach 2:
The encapsulation region serves as an intermediary medium between the integrated circuits and the cooling system. Instead of directly modifying the circuits, the patent uses the encapsulation material as a mediator to house cooling channels that indirectly cool the circuits through thermal conduction across the encapsulation interface.
2Temperature
If cooling channels are integrated directly into the three-dimensional structure, then thermal dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the cooling system into two independent parts: the integrated circuit stack and the encapsulation region with channels. This segmentation allows each component to be manufactured separately using standard processes, then assembled together, avoiding the need for complex multi-step fabrication to integrate channels directly into the 3D IC structure.
Solution Approach 2:
The encapsulation region with cooling channels is prepared in advance as a separate component before final assembly with the integrated circuit stack. This preliminary preparation of the cooling infrastructure simplifies the overall manufacturing process by decoupling the fabrication of electronic components from the thermal management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the heat dissipation process, achieving significant reductions in maximum and average temperatures of integrated circuits, with improved thermal exchange and reduced complexity in implementation compared to prior art methods.
Implementation Method 1
dissipation of the heat by circulation of a fluid
Implementation Method 2
heat can be exchanged with a thermal dissipation structure
Implementation Method 3
The device may furthermore comprise a pump in fluid communication with the first channels
Implementation Method 4
heat can be exchanged with a thermal dissipation structure which is fitted above the cap
Data Source
AI summary
A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.