3D System Integration Layout for Shorter Signal And Power Paths
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Solution Overview
Problem
Conventional Three-Dimensional Integrated Circuits (3DIC) structures experience high latency due to the need for signal communication through multiple components, including interposers, package substrates, and Printed Circuit Boards (PCBs), making high-speed data communication unsuitable for demanding applications like AI and 5G.
Innovation Solution
A system package is formed without a package substrate or printed circuit board, using redistribution lines for lateral communication between building blocks and locating power modules on the opposing side of redistribution lines, allowing for shorter signal and power-supplying paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If device dies are bonded to an interposer which is further bonded to a package substrate through solder regions, then the package structure is formed, but the signal communication path becomes long causing high latency
Solution Approach 1:
The patent removes the package substrate from the conventional 3DIC structure, extracting the source of signal path length. By bonding device dies directly to an interposer without an intermediate package substrate, the signal path is shortened, reducing communication latency while maintaining structural integrity through the interposer's redistribution layers and through-silicon vias.
2Adaptability or versatility
If multiple components (interposer, package substrate, PCB) are used for package formation, then the package is suitable for general applications, but it is not suitable for high-speed data communication
Solution Approach 1:
The patent extracts and removes the package substrate and PCB from the signal path, eliminating the bottlenecks for high-speed communication. The direct bonding of device dies to the interposer creates a streamlined architecture that maintains versatility for various applications while enabling high-speed data communication by reducing the number of interfaces and materials in the signal path.
Solution Approach 2:
The patent transitions from a multi-layer horizontal stacking architecture (device die → interposer → package substrate → PCB) to a more compact three-dimensional integration where device dies are directly mounted on the interposer. This dimensional reorganization shortens the signal path and reduces the physical distance signals must travel, enabling high-speed communication while maintaining adaptability.
3Ease of manufacture
If conventional package structure with package substrate is used, then manufacturing is simplified, but signal and power paths become longer
Solution Approach 1:
The patent removes the package substrate from the manufacturing process, simplifying the overall structure and reducing the number of bonding steps required. By directly bonding device dies to the interposer, the manufacturing process is streamlined while simultaneously reducing signal and power path lengths, as the interposer's redistribution layers provide direct electrical connections without the need for additional substrate routing.
Data Source
AI summary
A package includes a building block. The building block includes a device die, an interposer bonded with the device die, and a first encapsulant encapsulating the device die therein. The package further includes a second encapsulant encapsulating the building block therein, and an interconnect structure over the second encapsulant. The interconnect structure has redistribution lines electrically coupling to the device die. A power module is over the interconnect structure. The power module is electrically coupled to the building block through the interconnect structure.