3D Interconnect Component for Molded Semiconductor Packages
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Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in forming smaller semiconductor devices with higher density and efficient electrical interconnection, particularly in integrating standard solderable passive components without increasing package size or risk of electrical failures.
Innovation Solution
A method involving the formation of semiconductor component packages by providing a substrate with conductive traces, soldering SMDs, encapsulating with mold compound, and forming redistribution layers to connect conductive interconnects and traces, allowing for vertical interconnects and reduced package size, while embedding solderable components within the substrate to prevent melting and failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard solderable passive components are integrated into semiconductor packages, then component functionality and cost-effectiveness are improved, but package size and risk of electrical failures increase
Solution Approach 1:
The patent transitions from planar (2D) component arrangement to three-dimensional (3D) vertical stacking. Multiple passive components are stacked vertically above each other on the substrate, with conductive vias connecting different stacking levels. This dimensional change allows integration of multiple components within the same footprint area, reducing overall package size while maintaining full functionality.
Solution Approach 2:
The patent implements nested stacking where passive components are arranged in hierarchical layers. Lower-level components serve as foundations for upper-level components, with conductive vias penetrating through multiple layers to establish electrical connections. This nesting approach maximizes space utilization and enables high-density integration without increasing package footprint.
2Adaptability or versatility
If standard solderable passive components are integrated into semiconductor packages, then component functionality is improved, but risk of electrical failures increases
Solution Approach 1:
The patent applies conformal coating material over the passive components and conductive vias before final encapsulation. This coating creates a protective barrier that cushions the solder joints and conductive structures against moisture, oxidation, and mechanical stress, thereby preventing electrical failures before they occur.
Solution Approach 2:
The patent employs composite encapsulation structures combining mold compound with conformal coating layers. This composite approach provides both mechanical support and environmental protection, enhancing the reliability of solder joints and conductive vias against thermal cycling and humidity while maintaining electrical performance.
3Volume of moving object
If smaller semiconductor devices are manufactured, then power consumption and footprint are reduced, but manufacturing complexity and interconnection efficiency become challenges
Solution Approach 1:
The patent divides the manufacturing process into modular stages: substrate preparation, passive component placement, conductive via formation, stacking assembly, and encapsulation. Each stage is independently optimized and can be performed by specialized equipment, reducing overall manufacturing complexity despite the advanced 3D integration requirements.
Solution Approach 2:
The patent performs preliminary preparation of substrates with pre-defined conductive trace patterns and via structures before component placement. Passive components are pre-assembled in stacks with conductive vias already formed, allowing for rapid final assembly and reducing manufacturing complexity at critical stages.
4Area of stationary object
If smaller semiconductor devices are manufactured, then footprint is reduced, but efficient electrical interconnection becomes more difficult
Solution Approach 1:
The patent extends electrical interconnection from two-dimensional planar traces to three-dimensional vertical pathways. Conductive vias penetrate through multiple stacking levels, providing direct vertical electrical connections between components on different levels. This 3D interconnection approach maintains efficient electrical pathways while enabling compact footprint reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of standard, low-cost passive components with reduced risk of electrical failures, achieving smaller form factors suitable for IoT devices and other miniature electronic systems without increasing package size or complexity.
Implementation Method 1
soldering a plurality of surface mount devices (SMDs) to the substrate with solder
Data Source
AI summary
A method of making a semiconductor component package can include providing a substrate comprising conductive traces, soldering a surface mount device (SMD) to the substrate with solder, encapsulating the SMD on the substrate with a first mold compound over and around the SMD to form a component assembly, and mounting the component assembly to a temporary carrier with a first side of the component assembly oriented towards the temporary carrier. The method can further include mounting a semiconductor die comprising a conductive interconnect to the temporary carrier adjacent the component assembly, encapsulating the component assembly and the semiconductor die with a second mold compound to form a reconstituted panel, and exposing the conductive interconnect and the conductive traces at the first side and the second side of the component assembly with respect to the second mold compound.