3D Printed Interconnect Housing for Dense RF Pin Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional RF connectors have limitations such as low density pin count, poor isolation between adjacent pins, and non-compliance with VITA standards, making them unsuitable for certain applications.
Innovation Solution
A 3D printed interconnect device with a housing featuring elongate through holes with bend angles less than ninety degrees, allowing for high-density socket adaptors arranged in a two-dimensional grid, optimized isolation, and phase matching between socket adaptors and wires, ensuring VITA compliance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional RF connectors are used, then they provide basic connectivity, but they have low density pin count and poor isolation between adjacent pins
Solution Approach 1:
The patent transitions from traditional planar or linear pin arrangements to a three-dimensional spatial configuration where socket adaptors are positioned at different depths and angles within the housing. This dimensional change allows higher pin count density while maintaining isolation by utilizing vertical and angular separation rather than only horizontal spacing.
Solution Approach 2:
The patent implements a nested structure where socket adaptors are inserted into elongate through holes within the housing, creating a layered configuration. The first and second socket adaptors are nested at different positions along the length of the through holes, allowing compact arrangement with optimized isolation between adjacent pins while maximizing pin count density.
2Adaptability or versatility
If conventional RF connectors are used, then they provide basic interconnect functionality, but they do not meet VITA compliance requirements
Solution Approach 1:
The patent divides the interconnect device into distinct functional segments: a housing structure, elongate through holes, first socket adaptors, and second socket adaptors. This segmentation allows each component to be optimized independently for VITA compliance while managing overall structural complexity through modular design.
Solution Approach 2:
The patent applies different structural characteristics to different parts of the device: the housing provides mechanical support and positioning, the elongate through holes provide electrical and mechanical connection pathways, and the socket adaptors provide interface functionality. Each local region is optimized for its specific function to meet VITA requirements without requiring the entire structure to be overly complex.
3Manufacturing precision
If 3D printed housing with bent apertures is used, then phase matching and optimized isolation are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical machining processes with 3D printing technology to create the housing with bent apertures. This substitution enables complex curved geometries and precise angular configurations (bend angles less than ninety degrees) to be manufactured directly as single integrated parts, achieving phase matching precision without the complexity of multiple machining operations and assemblies.
Data Source
AI summary
Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.