3D Lateral-Plate Capacitor Structure for High Capacitance Density
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Solution Overview
Problem
There is a need to miniaturize capacitors while maintaining significant capacitance for small dimensions, which existing technologies have not effectively addressed.
Innovation Solution
The solution involves a capacitor design with an assembly of metal pads and plates, where a first insulating layer and a second conductive layer are conformally applied, with the pads and plates made of the same material, and the use of atomic layer deposition for forming these layers, allowing for efficient capacitance in compact form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional capacitor designs are used, then manufacturing is simpler, but capacitance density is insufficient for miniaturized devices
Solution Approach 1:
The patent transitions from planar capacitor plates to vertically stacked three-dimensional plates, utilizing the vertical dimension to increase capacitance density. Multiple plates are stacked above each other between common pads, effectively using spatial volume rather than just surface area to achieve higher capacitance in a compact footprint.
Solution Approach 2:
The capacitor structure employs nested insulation layers where a first insulation layer is conformally deposited between the plates, and a second insulation layer is deposited over the first layer. This nested configuration provides electrical isolation while maximizing the use of available space within the capacitor structure.
2Volume of moving object
If capacitor size is reduced for miniaturization, then device integration improves, but capacitance value decreases
Solution Approach 1:
By stacking multiple capacitor plates vertically in the third dimension, the patent achieves high capacitance values within a small planar footprint. The vertical stacking allows multiple capacitance elements to be combined in series or parallel configurations, maintaining total capacitance while reducing the device's horizontal volume occupation.
Solution Approach 2:
The patent employs composite material structures with plates made of conductive materials and insulation layers made of dielectric materials. This composite approach allows optimization of each material's properties for its specific function, achieving high capacitance density while maintaining electrical isolation and mechanical stability in a miniaturized structure.
3Quantity of substance
If conformal insulation layers are added to increase capacitance density, then manufacturing complexity increases
Solution Approach 1:
The conformal insulation layers are deposited using atomic layer deposition (ALD) technology, which automatically conforms to the underlying plate structures and fills gaps uniformly. This self-adjusting deposition process eliminates the need for complex masking and alignment steps, as the insulation material naturally follows the topography of the capacitor plates, simplifying manufacturing despite the increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of capacitors with high capacitance in small dimensions, effectively addressing the challenge of miniaturization by ensuring efficient electrical coupling and insulation, thereby enhancing the performance of electronic devices.
Implementation Method 1
forming the first insulating layer and the second conductive layer by an atomic layer deposition method
Data Source
AI summary
A device includes at least one capacitor. The capacitor includes an assembly of two metal pads and at least two metal plates, each plate extending at least from one pad to the other, a first insulating layer conformally covering said assembly, a second conductive layer conformally covering the first layer.