3D Layer Shaping Electronic Circuit Production Method
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Solution Overview
Problem
Existing 3D layer shaping methods for electronic circuits face challenges in achieving optimal electrical and mechanical properties, as the characteristics of metal-containing fluids used differ significantly, affecting the final properties of the circuit, and the type of fluid used is critical in determining these properties.
Innovation Solution
The method involves selectively using fluids containing nano-sized metal nanoparticles for wiring formation and micro-sized metal microparticles for connection terminal formation, allowing for improved electrical conductivity and mechanical strength through controlled curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fluid containing metal particles is used for 3D layer shaping of electronic circuits, then the electrical properties and mechanical properties can be improved, but the selection complexity increases because different parts of the electronic circuit require different fluid characteristics
Solution Approach 1:
The patent applies local quality by using different metal particle size fluids for different parts of the electronic circuit. Specifically, wiring regions use one type of metal particle fluid while connection terminal regions use another type, allowing each region to have optimized properties for its specific function.
Solution Approach 2:
The patent segments the electronic circuit into distinct regions (wiring and connection terminals) and applies different fluid characteristics to each segment. This segmentation allows independent optimization of fluid properties for each functional area, resolving the selection complexity.
2Reliability
If nano-sized metal nanoparticles are used for wiring formation, then electrical conductivity is improved, but mechanical strength may be compromised compared to micro-sized particles
Solution Approach 1:
The patent uses nano-sized metal particles specifically for wiring formation where electrical conductivity is the primary requirement, while using micro-sized metal particles for connection terminals where mechanical strength is more critical. This local quality approach optimizes each region for its primary function.
Solution Approach 2:
The patent employs composite material strategies by combining different metal particle sizes in different regions of the circuit. The wiring uses nano-particle composites for conductivity, while connection terminals use micro-particle composites for strength, creating a multi-material system optimized for different requirements.
3Strength
If micro-sized metal microparticles are used for connection terminal formation, then mechanical strength is improved, but electrical conductivity may be reduced compared to nano-sized particles
Solution Approach 1:
The patent applies micro-sized metal particles specifically to connection terminals where mechanical strength is the primary requirement, while accepting that electrical conductivity will be optimized for that region's function rather than maximizing it. This local quality approach matches material properties to functional requirements.
Solution Approach 2:
The patent segments the circuit into wiring and connection terminal regions, applying different particle size fluids to each segment. This segmentation allows the connection terminals to use micro-particles for strength without compromising the overall circuit performance, as the wiring regions use nano-particles for conductivity.
4Ease of manufacture
If a single type of metal-containing fluid is used for all electronic circuit components, then the process is simplified, but optimal electrical and mechanical properties cannot be achieved for all parts
Solution Approach 1:
The patent implements local quality by using different metal particle size fluids for different circuit components. Wiring regions receive one fluid type optimized for conductivity, while connection terminal regions receive another fluid type optimized for mechanical strength, allowing optimal properties for each part.
Solution Approach 2:
The patent segments the circuit fabrication process into different fluid application steps for different regions. This segmentation enables each region to receive optimally tailored fluid characteristics, achieving optimal electrical and mechanical properties for all parts while maintaining a systematic manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of electronic circuits with enhanced electrical properties and mechanical strength by leveraging the characteristics of metal particles, achieving low resistance in wiring and improved tensile strength in connection terminals.
Implementation Method 1
the wiring having low resistance can be formed by curing nano-sized metal nanoparticles by contacting or fusing with each other
Implementation Method 2
a layer having a certain thickness can be formed with micro-sized metal microparticles, and mechanical properties such as tensile strength of the connection terminal after shaping can be improved
Data Source
AI summary
To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.