3D Logic Block Assembly Using Node-Strut Lattice Modules
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Solution Overview
Problem
Current integrated circuit design processes require multiple layers of abstraction and rely on various digital design applications to create complex logic blocks, which are inefficient for producing physical structures containing logic blocks from single transistors to processor cores through automated assembly.
Innovation Solution
A system utilizing two basic 2-dimensional parts, a node and a strut, assembled into 3-dimensional structures to create digital logic blocks, allowing for the integration of small surface mount IC packages to form complex digital structures, including processors, through a lattice architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional multiple layers of abstraction and digital design applications are used to create complex logic blocks, then design flexibility and functionality are improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent segments complex digital logic blocks into standardized modular components that can be independently manufactured and then assembled. Each module contains specific logic functions (AND, OR, NOT gates, flip-flops) that can be combined to create complex circuits, reducing overall manufacturing complexity while maintaining design flexibility.
Solution Approach 2:
The patent creates universal standardized modules that can serve multiple functions. The same basic module types can be configured to implement different logic functions by changing the interconnection pattern rather than manufacturing different specialized components, thereby reducing manufacturing complexity while maintaining versatility.
2Manufacturing precision
If traditional integrated circuit fabrication processes are used, then manufacturing precision is improved, but production time and assembly complexity increase
Solution Approach 1:
The patent applies preliminary action by pre-fabricating standardized logic modules using precise integrated circuit fabrication processes before final assembly. These pre-fabricated modules are designed to interconnect through simple standardized interfaces, allowing complex circuits to be assembled quickly without requiring precise alignment and interconnection of individual transistors and gates during final production.
3Adaptability or versatility
If complex logic blocks are designed using multiple abstraction layers, then functional capability is improved, but ease of automated assembly deteriorates
Solution Approach 1:
The patent changes the parameter of modularity by transforming complex logic blocks into standardized modules with uniform physical and electrical interface parameters. This standardization enables automated assembly systems to handle diverse logic functions using the same assembly processes and equipment, thereby improving ease of automated assembly while maintaining functional capability through modular configuration.
Data Source
AI summary
A system and method for producing discretely assembled logic blocks where the logic block assemblies are a 3-dimensional representation of the normal digital design hierarchy. The blocks contain embedded logical functions that are built up from only a few basic 2-dimensional parts that are assembled into a 3-dimensional structure that realizes a particular logic or computing element. These structures can be combined to produce more complex digital structures and even processors. The two basic structural parts are a node and a strut with the strut typically including an embedded logic function. These are combined to produce spatially distributed structures.