3D Magnetic Core Inductors for Compact High-Density Integration
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Solution Overview
Problem
Existing solutions for high-value inductors in integrated circuits face challenges such as large footprint, high cost, and limited inductor density due to their two-dimensional structure, which leads to increased surface area requirements and power loss issues.
Innovation Solution
The development of three-dimensional magnetic core devices with helical coils and laminated magnetic structures that minimize surface footprint, enhance inductor density, and improve Q-factor values by using conductive traces and magnetic shells with insulator layers, allowing for high-energy density inductors with reduced energy loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two-dimensional metal patterns or surface mount inductors are used, then inductors can be integrated into circuits, but the footprint and surface area increase
Solution Approach 1:
The patent transitions from two-dimensional planar inductor structures to three-dimensional vertical structures by stacking multiple metal layers and using via connections to form helical or spiral coil patterns in the vertical dimension. This allows the inductor to achieve higher inductance values and better performance while occupying less surface area on the PCB or substrate.
2Ease of manufacture
If non-magnetic medium surrounds the conductor turns, then on-die or on-substrate inductors can be realized, but the inductance value becomes limited and cost increases
Solution Approach 1:
The patent employs composite material structures combining magnetic core materials with conductor windings in a three-dimensional configuration. The magnetic core material is strategically placed within and around the coil structure to concentrate magnetic flux, thereby achieving high inductance values in a compact footprint suitable for on-die or on-substrate integration without requiring large surface areas.
3Quantity of substance
If magnetic core inductors are placed side-by-side on PCB or substrate, then high value inductors can be realized, but the packaging substrate size increases
Solution Approach 1:
The patent utilizes vertical stacking of multiple conductor layers separated by insulating layers, with via connections forming three-dimensional coil patterns. This vertical configuration allows high-value inductors to be realized within a compact footprint on the packaging substrate, eliminating the need for large side-by-side placements while maintaining high inductance values through optimized magnetic flux paths.
4Adaptability or versatility
If air core inductors are used on TSI RDL metals, then integration is achieved, but Q-factor decreases and cost increases
Solution Approach 1:
The patent introduces magnetic core materials into the inductor structure to replace air cores, thereby concentrating magnetic flux and improving the Q-factor. The composite structure combines magnetic materials with conductor traces on the TSI substrate, achieving both high Q-factor performance and compatibility with existing TSI manufacturing processes while reducing the need for costly deep via etching and filling operations.
5Adaptability or versatility
If planar spiral inductors are used, then integration is achieved, but manufacturing cost increases
Solution Approach 1:
The patent employs three-dimensional vertical coil structures formed by stacking multiple metal layers with via connections, replacing costly planar spiral inductor fabrication. This vertical configuration allows inductors to be integrated using standard multi-layer PCB or substrate manufacturing processes, significantly reducing manufacturing costs while maintaining design flexibility and integration capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact, high-density inductors with improved Q-factor values, reducing energy loss and cost while maintaining high current handling capabilities, suitable for applications like voltage regulator circuits and RF circuits.
Implementation Method 1
the value of the inductance is directly proportional to the amount of the magnetic field coupled to the turns of the conductor
Implementation Method 2
Magnetic core material is used in surface mount discrete inductors
Implementation Method 3
laminated magnetic structures that minimize surface footprint, enhance inductor density, and improve Q-factor values
Implementation Method 4
An inductor usually contains one or more turns of a conductor, around an air core or magnetic core, and the value of the inductance is directly proportional to the amount of the magnetic field coupled to the turns of the conductor due to an alternating current flowing through that conductor
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2A~2C
AI summary
A 3-dimensinal (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.