3D Memory Access Transistor Layout for Shared Word Line Selection

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Solution Overview

Problem

Conventional three-dimensional memory devices require multiple word line contact via structures for each memory block, leading to increased staircase area and inefficiencies in memory block selection.

Innovation Solution

The implementation of access transistors between the memory array region and the staircase region, where one word line contact via structure can be used for all memory blocks, reducing the staircase area by allowing a single contact to function as a 'word line gate' for multiple memory blocks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple word line contact via structures are used for each memory block, then memory block selection is achieved, but staircase area increases

Engineering Contradiction:
Improvememory block selectionVSAvoidstaircase area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the functions of multiple word line contact via structures into a single contact structure. This single contact structure serves as a word line gate that controls multiple memory blocks simultaneously, eliminating the need for separate contact vias for each block and thereby reducing the staircase area while maintaining memory block selection capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single word line contact via structure is designed to perform multiple functions: it serves as a common contact for multiple memory blocks and acts as a word line gate that can select different blocks by applying appropriate voltages. This multi-functional design reduces the overall number of contact structures needed in the staircase region.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple word line contact via structures are used for each memory block, then memory block selection is achieved, but device complexity increases

Engineering Contradiction:
Improvememory block selectionVSAvoidcontact via structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate contact via structures into a single integrated contact structure. This merger simplifies the device architecture by reducing the number of discrete components and their interconnections, thereby lowering device complexity while preserving the essential memory block selection functionality through the word line gate mechanism.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If a single word line contact via structure is used for all memory blocks, then staircase area is reduced, but memory block selection efficiency must be improved

Engineering Contradiction:
Improvestaircase areaVSAvoidmemory block selection efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The single word line contact via structure is designed as a multi-functional word line gate that can selectively control multiple memory blocks. By applying different voltage levels to this single structure, the system can efficiently select different blocks for read, write, or erase operations, maintaining high selection efficiency while minimizing the staircase area.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The word line gate structure employs dynamic voltage control to achieve memory block selection. By dynamically adjusting the voltage applied to the single contact structure, the system can selectively activate or deactivate access to different memory blocks, enabling efficient block selection without requiring multiple static contact structures.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS11882702B2Lateral transistors for selecting blocks in a three-dimensional memory array and methods for forming the same
Publication Date: 2024.01.23 SANDISK TECHNOLOGIES LLC
  • US11882702B2 patent drawing
  • US11882702B2 patent drawing
  • US11882702B2 patent drawing

AI summary

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory opening fill structures including a respective vertical semiconductor channel and a respective vertical stack of memory elements extending through the alternating stack in a memory array region, via contact structures contacting the stepped surfaces of the electrically conductive layers at each step in a staircase region, and a vertical stack of access transistors located between the staircase region and the memory array region.