3D Memory Data Swapping With Bank-Level Interleaving
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Solution Overview
Problem
Existing 3D memory systems face limitations in swap speed improvements due to the ability to move data of only a single bank at a time through TSV channels, hindering high-speed memory access and bandwidth utilization.
Innovation Solution
A memory system with a swap controller that generates control commands to manage data swaps between layers, utilizing swap buffers and bank-level interleaving to move data units sequentially, optimizing data swap operations and improving TSV channel bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If data swap operation is performed through TSV channel in 3D memory system, then vertical stacking enables short interconnection distance and high-speed memory access, but swap speed is limited because only data of a single bank can be moved at a time
Solution Approach 1:
The patent segments the data swap operation into multiple independent unit operations, where each unit can be processed simultaneously through different TSV channels. By dividing the swap task into manageable segments that can be executed in parallel, the system overcomes the limitation of moving only single bank data at a time through vertical stacking.
Solution Approach 2:
The patent introduces a horizontal dimension to the vertical stacking architecture by enabling parallel data movement across multiple banks simultaneously. This dimensional expansion allows the system to leverage both vertical (through TSV channels) and horizontal (across multiple banks) pathways for data transfer, thereby increasing swap speed and bandwidth utilization.
2Productivity
If vertically stacked layers perform swap operation through TSV channel, then 3D memory structure achieves reduced chip size and low power consumption, but swap operation is constrained to single bank data movement
Solution Approach 1:
The patent implements dynamic control mechanisms that adaptively manage data movement between banks based on real-time operational requirements. The system dynamically selects which banks to access and how to route data through TSV channels, enabling flexible and efficient swap operations that optimize performance while managing the complexity of multi-bank coordination.
Solution Approach 2:
The patent introduces intermediary control structures that mediate between the swap operation requests and the physical data movement through TSV channels. These intermediaries coordinate the complex interactions between multiple banks and channels, simplifying the control architecture while enabling parallel data movement across multiple banks simultaneously.
Data Source
AI summary
Disclosed are a memory system for a data swap and an operating method thereof. A memory system may include a plurality of layers coupled through at least one through silicon via (TSV) channel and a swap controller configured to generate a swap control command in response to a request received from an external host and to device swap data into a plurality of data units having a predetermined size to perform a swap operation between a first layer and a second layer among the plurality of layers, wherein the first layer and the second layer include at least one swap buffer and control a movement of the plurality of data units in response to the swap control command.