3D Memory Cell Word Line with Dual Work Functions for Low Power

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Solution Overview

Problem

The integration density of two-dimensional semiconductor memory devices is limited by the cost and complexity of fine-pattern fabrication, prompting the need for three-dimensional semiconductor memory devices with higher integration capabilities.

Innovation Solution

A three-dimensional semiconductor memory device is developed with a dual work function electrode structure, including a low work function electrode and a high work function electrode, separated by a dipole inducing layer, which increases cell threshold voltage and reduces power consumption while maintaining refresh characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If two-dimensional semiconductor memory devices use fine-pattern fabrication to increase integration density, then integration degree increases, but fabrication cost and complexity increase significantly

Engineering Contradiction:
Improveintegration densityVSAvoidfabrication complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from two-dimensional planar memory cell layout to three-dimensional vertically stacked architecture. Memory cells are arranged in multiple layers with bit lines extending vertically, allowing integration density to increase without requiring proportionally finer lateral patterning, thus reducing fabrication complexity while maintaining high density

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Use of energy by moving object

If conventional word line structures are used, then device simplicity is maintained, but power consumption increases and refresh characteristics deteriorate

Engineering Contradiction:
Improvepower consumptionVSAvoidword line structure complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The word line structure employs different work function materials at different locations: a first work function material at the end adjacent to the bit line and a second work function material at the end adjacent to the capacitor. This local differentiation optimizes electrical characteristics for each function, reducing power consumption and improving refresh characteristics without requiring complete structural redesign

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The word line is constructed as a composite structure with multiple materials having different work functions. This composite approach allows simultaneous optimization of different functional regions of the word line, achieving lower power consumption and better refresh characteristics while maintaining structural integrity

Inventive Principle:
Principle #40Composite materials

3Reliability

If channel doping or increased channel concentration is used to adjust cell threshold voltage, then threshold voltage control is achieved, but parasitic capacitance increases and integration density decreases

Engineering Contradiction:
Improvethreshold voltage controlVSAvoidintegration density
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

A dipole inducing layer is introduced as an intermediary element between the gate dielectric layer and the word line. This dipole layer adjusts the flat-band voltage and threshold voltage through dipole moments without requiring channel doping or increased channel concentration, thereby maintaining integration density while achieving reliable threshold voltage control

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances memory cell integration density, reduces parasitic capacitance, and achieves low power consumption by adjusting the cell threshold voltage through the flat-band shift, without the need for channel doping or increased channel concentration.

Implementation Method 1

a dipole inducing layer disposed between the high work function electrode and the gate dielectric layer

Methodology Applied
Scientific EffectDipole inducing: Electrostatic Induction

Data Source

PatentUS20250016977A1Semiconductor device and method for fabricating the same
Publication Date: 2025.01.09 SK HYNIX INC
  • US20250016977A1 patent drawing
  • US20250016977A1 patent drawing
  • US20250016977A1 patent drawing

AI summary

Present invention relates to a highly-integrated memory cell and a semiconductor device including the same. According to an embodiment of the present invention, a semiconductor device comprises: an active layer including a channel, the active layer being spaced apart from a substrate and extending in a direction parallel to a surface of the substrate; a gate dielectric layer formed over the active layer; a word line laterally oriented in a direction crossing the active layer over the gate dielectric layer and including a low work function electrode and a high work function electrode, the high work function electrode having a higher work function than the low work function electrode; and a dipole inducing layer disposed between the high work function electrode and the gate dielectric layer.