3D Memory Cell Layout With Staggered Bit Line Spacing

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Solution Overview

Problem

Three-dimensional semiconductor structures face low integration due to the need to maintain distance between adjacent bit line structures, reducing the number of memory cells per unit area.

Innovation Solution

The arrangement of memory cells in staggered rows with shared bit line structures and staggered memory groups, along with a protruding bit line structure between adjacent cells, allows for increased density and integration by optimizing space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If memory cells are arranged in three-dimensional structure, then storage capacity is improved, but integration level is reduced due to non-compact arrangement

Engineering Contradiction:
Improvestorage capacityVSAvoidintegration level
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from traditional two-dimensional memory cell arrangement to a three-dimensional staggered arrangement where memory groups are positioned at different heights and offset from each other. This dimensional change allows memory cells to be stacked vertically while maintaining compact horizontal spacing, thereby increasing storage capacity without sacrificing integration level.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where memory groups are arranged in staggered rows at different vertical levels. Each memory group contains memory cells that are nested within the overall three-dimensional structure, with bit line structures extending between adjacent memory groups. This nesting approach maximizes space utilization and improves integration.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If distance is maintained between adjacent bit line structures, then reliability is improved, but area utilization is reduced

Engineering Contradiction:
Improvesignal integrityVSAvoidarea utilization
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies local quality by positioning bit line structures to extend only in specific regions where needed, rather than maintaining uniform spacing across the entire structure. The bit lines protrude from memory cell arrays and extend between adjacent memory groups only where signal transmission is required, allowing closer spacing in areas where interference is minimized while maintaining reliability where bit lines are present.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the bit line structures into discrete portions that extend between specific adjacent memory groups rather than continuous structures. This segmentation allows for optimized spacing - bit lines are present only where needed for electrical connection, reducing the total area occupied while maintaining signal integrity in critical regions.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12598732B2Semiconductor structure and method for manufacturing memory
Publication Date: 2026.04.07 CHANGXIN MEMORY TECH INC
  • US12598732B2 patent drawing
  • US12598732B2 patent drawing
  • US12598732B2 patent drawing

AI summary

A semiconductor structure includes a plurality memory group provided in rows, each of the memory groups includes a plurality of memories arranged at intervals along a row direction, and for two adjacent ones of the memory groups, the memories in one memory group and the memories in another memory group are staggered.