3D Metal Circuit Board Etching Before Packaging
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Solution Overview
Problem
Traditional metal lead frame manufacturing methods, such as mechanical punching and chemical etching, limit the integration of objects within the lead frame, resulting in structural weaknesses, uncontrollable etching depth, and inability to create multi-layer three-dimensional metal circuits, which restricts functionality and application.
Innovation Solution
A method involving pre-plating copper on a metal substrate, applying photoresist films, patterning, and chemical etching to create a three-dimensional system-in-package metal circuit board structure with embedded components and multiple wiring layers, allowing for the integration of objects and enhanced structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical punching is used to manufacture lead frame, then production efficiency is improved, but structural strength and ability to embed objects deteriorate
Solution Approach 1:
The patent replaces mechanical punching with chemical etching technology to manufacture the metal circuit board. This substitution allows for more precise control over the etching depth and pattern, enabling the formation of complex three-dimensional structures with embedded components while maintaining production efficiency. The chemical etching process uses photoresist films and etching solutions to create precise patterns without the mechanical stress and structural weakness caused by punching.
2Manufacturing precision
If chemical etching is used to manufacture lead frame, then manufacturing precision is improved, but etching depth control and multi-layer integration deteriorate
Solution Approach 1:
The patent transitions from traditional two-dimensional lead frame structures to three-dimensional metal circuit boards with multiple wiring layers. By adding the vertical dimension through multi-layer construction, the patent enables complex integration of components and circuits while maintaining precise etching control. The three-dimensional structure allows components to be embedded at different depths and positions, creating system-in-package configurations that overcome the limitations of planar designs.
Solution Approach 2:
The patent employs preliminary actions by first forming the metal circuit board structure with embedded components before final packaging. Photoresist films are applied and patterned in advance, and components are embedded during the etching process itself rather than after. This preliminary integration of components into the circuit board structure enables complex multi-layer configurations while maintaining manufacturing precision and controlling etching depth through the photoresist mask system.
3Device complexity
If traditional lead frame structure is used, then simplicity of structure is maintained, but functionality and adaptability deteriorate
Solution Approach 1:
The patent creates metal circuit boards that serve multiple functions within a single structure. The three-dimensional metal circuit board simultaneously provides electrical connectivity through multiple wiring layers, mechanical support for embedded components, thermal management pathways, and system-level integration capabilities. This multi-functional design replaces traditional separate components (lead frame, substrate, packaging) with a unified structure that enhances adaptability while managing complexity through systematic design.
Solution Approach 2:
The patent implements nesting by embedding components directly within the metal circuit board structure at different depths and positions. The system-in-package configuration allows smaller components to be nested within the larger circuit board structure, creating a hierarchical arrangement that maximizes functionality within a compact form factor. This nested design enables complex functionality while maintaining a relatively simple external structure.
4Volume of moving object
If ultra-thin lead frame is used, then package size is reduced, but structural integrity and embedding capability deteriorate
Solution Approach 1:
The patent uses composite material structures in the metal circuit board, combining metal layers with embedded components and packaging materials. The multi-layer metal structure with integrated components creates a composite system that achieves high structural integrity despite thin overall dimensions. The combination of different materials and the three-dimensional arrangement of conductive paths provide mechanical strength and embedding capability while maintaining a compact, ultra-thin profile suitable for small package applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the embedding of objects and components within the lead frame, improving structural strength and enabling multi-layer three-dimensional metal circuitry, while maintaining a compact and secure package with embedded chips undetectable by X-ray, facilitating heat dissipation and system-level functionality.
Implementation Method 1
pre-plating copper on a metal substrate
Implementation Method 2
applying photoresist films, patterning, and chemical etching
Data Source
AI summary
Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base island and pins are arranged in the metal substrate frame; a chip is inversely arranged on a front face of the base island and the pins; a conductive pillar is arranged on a front face of the pins; the region on the periphery of the base island, the region between the base island and the pins, the region between one pin and another, the region above the base island and the pins, the region below the base island and the pins, and the outside of the chip and the conductive pillar are all enveloped with a plastic packaging material.