3D-Printed Micro-Optics Module for PCB Current Sensor Assembly
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Solution Overview
Problem
Existing methods for producing optical structures on circuit boards are costly, complex, and limited to simple intensity measurements, while free beam optics and fiber optics methods are incompatible with board population and suffer from high material costs, sensitivity to temperature and impact, and require skilled labor.
Innovation Solution
A micro-optics module with predefined holders for optical and electro-optical components produced by 3D printing, allowing for precise, cost-effective integration onto circuit boards, using materials like aluminum, steel, and copper, which are temperature-resistant and mechanically stable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If free beam optics or fiber optics methods are used to create optical structures, then optical functionality can be achieved, but production costs become very high due to precision optomechanical holders and skilled labor requirements
Solution Approach 1:
The patent combines optical components and their mounting structures into a single integrated circuit board design. The housing with predefined holders is produced by 3D printing directly as part of the circuit board assembly, eliminating the need for separate precision optomechanical holders and reducing the need for skilled manual assembly.
Solution Approach 2:
The invention changes the manufacturing parameters from traditional precision machining and manual assembly to 3D printing technology. This allows for cost-effective production of precise optical component holders while maintaining the required optical functionality.
2Manufacturing precision
If complex optical structures are produced separately from circuit boards, then optical precision can be maintained, but the assembly process becomes incompatible with standard circuit board population methods
Solution Approach 1:
The patent merges the optical structure housing with the circuit board into a single integrated component. The housing contains predefined holders for optical components that are precisely positioned during the 3D printing process, allowing standard circuit board population methods to be used without requiring separate optical assembly steps.
3Length of stationary object
If optical fibers are used to extend light beam distance, then optical functionality is maintained, but sensitivity to temperature and impact increases
Solution Approach 1:
The patent extracts the optical components from fragile optical fiber connections and integrates them directly into the 3D printed housing. This eliminates the need for long optical fiber travel and removes the associated sensitivity to temperature and impact while maintaining the required optical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simple, cost-effective production of micro-optics modules that can be easily populated on circuit boards, reducing the need for complex adjustments and minimizing errors, while providing a wide range of optical functionalities for current measurement.
Implementation Method 1
The at least one housing, with the at least one pre-defined holder, is produced according to the invention by 3D printing
Implementation Method 2
Photodiodes, which convert light into electrical current
Data Source
AI summary
The invention relates to a micro-optics module (1) for evaluating optical current sensors and its manufacture as well as a method for populating printed circuit boards, wherein the micro-optics module (1) has at least one housing (2), which comprises at least one predefined holder (3) for at least one optical and/or electro-optical component (4). The at least one housing (2) with the at least one predefined holder (3) is produced by means of 3D printing.