3D Microcircuit Card Assembly with Dual-Sided Passive Cooling Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional 3D circuit card assemblies face challenges in heat dissipation due to reduced heat path locations, leading to inefficient thermal management, and existing solutions involving active heat transfer systems increase packaging size and costs.
Innovation Solution
A 3D microcircuit card assembly with dual-sided passive cooling paths, featuring an alternating stack of substrates and intermediate heat dissipation plates encased in a thermally conductive dissipation cover, where heat is transferred from substrates to the cover's sidewalls and upper surface for dissipation into the atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active heat transfer systems (fans or fluid-based heat exchangers) are used to address thermal management in 3D packaging, then heat dissipation effectiveness is improved, but packaging size and system complexity increase
Solution Approach 1:
The patent extracts the active cooling components (fans, fluid-based heat exchangers) from the packaging system and replaces them with a passive thermal management approach. The heat dissipation function is achieved through thermally conductive materials and geometric design of the substrate and interposer structures that conduct heat away from the chips without requiring additional active cooling devices, thereby reducing packaging size while maintaining heat dissipation effectiveness
Solution Approach 2:
The patent implements self-service thermal management where the substrate and interposer structures serve dual purposes: electrical interconnection and passive heat dissipation. The thermally conductive materials inherent in the packaging structure automatically conduct heat away from the chips through temperature gradients without requiring external control systems or additional components, enabling the system to manage its own thermal conditions
2Temperature
If active heat transfer systems are implemented for thermal management in 3D packaging, then heat dissipation is improved, but manufacturing costs increase
Solution Approach 1:
The patent applies multi-functionality by designing the substrate and interposer to simultaneously perform electrical interconnection and thermal management functions. The same structural elements that provide electrical pathways also serve as heat conduction paths, eliminating the need for separate active cooling components and reducing overall manufacturing costs while maintaining effective heat dissipation
3Area of stationary object
If chips are stacked vertically in 3D packaging to reduce footprint, then packaging area is reduced, but heat dissipation paths are reduced leading to thermal management challenges
Solution Approach 1:
The patent extends heat dissipation from traditional two-dimensional planar paths to three-dimensional pathways by utilizing the vertical stacking structure itself. Heat is conducted through the vertical interposer structures and substrate layers, transforming the heat dissipation geometry to match the 3D chip arrangement, thereby maintaining effective thermal management while achieving compact packaging area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates heat from central areas without active cooling components, reducing packaging size and costs while maintaining efficient thermal management.
Implementation Method 1
The passive heat transfer unit includes at least one intermediate heat dissipation plate configured to receive heat from the substrate package
Implementation Method 2
a thermally conductive dissipation cover configured to dissipate the heat received from the at least one intermediate heat dissipation plate away from the 3D circuit card assembly
Data Source
AI summary
A three-dimensional (3D) circuit card assembly includes a substrate package and a passive heat transfer unit. The substrate package includes a plurality of individual substrates stacked atop one another. The passive heat transfer unit includes at least one intermediate heat dissipation plate configured to receive heat from the substrate package, and a thermally conductive dissipation cover configured to dissipate the heat received from the at least one intermediate heat dissipation plate away from the 3D circuit card assembly.