3D Microelectrode Arrays with Orthogonal Electroplated Connections

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Solution Overview

Problem

Conventional microfabricated electrodes are limited in their ability to create customizable 3D arrays for neural recording, with fixed linear or comb-like arrangements that do not adapt to the specific properties of brain circuits, and face challenges in reliable mechanical and electrical assembly for high-density connections in 3D structures.

Innovation Solution

The development of silicon-based 3D microelectrode arrays with customizable electrode locations and geometries, enabled by software-driven approaches and electroplating techniques for creating high-density electrical connections between orthogonal surfaces, allowing for scalable neural recording channels and integration with light delivery devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional linear or comb-like electrode arrangements are used, then manufacturing is simple, but adaptability to specific brain circuit properties is poor

Engineering Contradiction:

Improveadaptability to brain circuit propertiesVSAvoidelectrode array complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The electrode array is divided into multiple modular components including a base plate, multiple probe assemblies, and interchangeable electrode arrays. Each probe assembly can be independently configured with specific electrode geometries, spacing, and patterns to match different neural target structures, allowing customization without requiring complete redesign of the entire system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base plate and probe assembly architecture serves multiple functions: mechanical support, electrical connection, alignment, and interchangeability. The standardized interface allows the same base plate to accommodate various electrode array configurations, making the system universally applicable to different experimental requirements while maintaining manufacturing simplicity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If high-density electrical connections are fabricated between orthogonal surfaces, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical connection precisionVSAvoidassembly complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Conductive pads and connection structures are pre-fabricated on the base plate and probe assemblies using standard microfabrication techniques before final assembly. This preliminary preparation ensures precise electrical connection geometry is achieved through controlled electroplating and pad formation, while the modular design simplifies the overall assembly process by allowing these precision features to be created in separate, manageable steps.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If customizable electrode geometries are implemented, then adaptability to neural targets is improved, but ease of manufacture decreases

Engineering Contradiction:

Improveelectrode geometry customizationVSAvoidmanufacturing ease

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Different regions of the electrode array are designed with locally optimized geometries, spacing, and configurations tailored to specific neural target properties. Each electrode array can have customized electrode sizes, shapes, and positions while using the same base fabrication processes, allowing local customization without requiring complete manufacturing process redesign.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable and customizable 3D neural recording with high-density electrical connections, facilitating precise measurement of neural activity and compatibility with existing light delivery systems, enhancing the usability and effectiveness of neural probes in vivo.

Implementation Method 1

electrical connections are fabricated between two orthogonal surfaces by electrolytic electroplating

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS8939774B2Methods and apparatus for three-dimensional microfabricated arrays

Publication Date: 2015.01.27 MASSACHUSETTS INST OF TECH

AI summary

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.