3D Microelectrode Array with Vertical Microneedles for Signal Capture

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Solution Overview

Problem

Current microelectrode arrays are inadequate for interfacing with three-dimensional microphysiological systems, particularly in high-throughput formats, due to low signal-to-noise ratios and poor tissue-specific architecture, limiting their ability to capture physiologically relevant signals and requiring improved tools for electrophysiological data acquisition in complex cellular models.

Innovation Solution

A three-dimensional microelectrode array with integrated microfluidic ports and transparent substrates, featuring hypodermic microneedles, metallic traces, and microtroughs, enabling simultaneous electrical, optical, and microfluidic interrogation of electrogenic cell constructs, utilizing micromilling and magnetic insertion processes for precise fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional two-dimensional microelectrode arrays are used, then device complexity is reduced and ease of manufacture is improved, but signal-to-noise ratio deteriorates and measurement precision is reduced due to poor interface with three-dimensional tissue architecture

Engineering Contradiction:
Improvesignal-to-noise ratioVSAvoidelectrode array structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent transitions from conventional two-dimensional planar electrodes to three-dimensional microelectrode arrays with vertical microneedle structures extending through the substrate thickness. This dimensional change enables the electrodes to penetrate and interface with three-dimensional tissue architectures, significantly improving signal-to-noise ratio by establishing direct electrical contact with cells throughout the tissue depth rather than only at the surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds multiple microelectrodes within a single substrate, creating a nested structure where numerous electrodes are integrated into one cohesive device. The substrate contains multiple microelectrodes that extend through its thickness, allowing high-throughput measurements to be performed within a compact, manufacturable form factor.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Measurement precision

If three-dimensional microelectrode arrays are implemented, then measurement precision and tissue interface are improved, but ease of manufacture deteriorates due to complex fabrication processes

Engineering Contradiction:
Improveelectrophysiological data qualityVSAvoidfabrication process
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent divides the electrode array into modular components: a substrate with formed microelectrodes and separate culture well structures. This segmentation allows each component to be manufactured independently using optimized processes, then assembled together. The substrate can be fabricated with precise electrode positions using standard microfabrication techniques, while culture wells can be added separately, simplifying overall manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent designs a universal substrate structure that can accommodate multiple electrode configurations and interface with various three-dimensional cell culture formats. The standardized substrate with vertical microneedles can be used across different applications and cell types, reducing manufacturing complexity by using a platform approach rather than custom fabrication for each application.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If transparent substrates are used, then optical measurement capability is improved, but manufacturing precision requirements increase due to additional material selection constraints

Engineering Contradiction:
Improvemulti-modal data acquisitionVSAvoidsubstrate fabrication
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent employs transparent substrate materials such as glass or transparent polymers that combine optical clarity with electrical insulation properties. These composite materials enable simultaneous optical imaging and electrical recording through the same substrate, providing multi-modal data acquisition capability while maintaining manufacturability through established material processing techniques.

Inventive Principle:
Principle #40Composite materials

4Productivity

If high-throughput format is implemented, then productivity is improved, but device complexity increases due to integration of multiple electrodes and functions

Engineering Contradiction:
Improvedata acquisition throughputVSAvoidelectrode array integration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges multiple electrodes and microfluidic features into a single integrated substrate. By combining electrical recording electrodes, optical access pathways, and culture chamber structures into one unified device, the system achieves high-throughput capability without proportionally increasing operational complexity. Multiple measurements can be performed simultaneously across the array.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12447471B2Three-dimensional microelectrode array having electrical and microfluidic interrogation of electrogenic cell constructs
Publication Date: 2025.10.21 THE ADMINISTRATORS OF THE TULANE EDUCATIONAL FUND
  • US12447471B2 patent drawing
  • US12447471B2 patent drawing
  • US12447471B2 patent drawing

AI summary

A three-dimensional (3D) microelectrode array for in vitro electrical and microfluidic interrogation of electrogenic cell constructs includes a substrate having a plurality of micro vias. A hypodermic microneedle is received within each micro via of a first subgroup of the plurality of micro vias and each has a length that exceeds the thickness of the substrate to form a hypodermic microneedle array on the top face of the substrate. Metallic traces are formed on the bottom face and interconnect the hypodermic microneedles. A culturing area is formed in the top face.