3D Microstructured Interconnects for High-Speed Data Transfer
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Solution Overview
Problem
Current methods for high-speed data transport between electronic devices on substrates face limitations due to increased power dissipation, heat removal challenges, and difficulties in routing traces, especially as data rates exceed conventional capabilities, with serial data links experiencing distortion and requiring equalization stages.
Innovation Solution
The development of a three-dimensional microstructure with a conductive shield and dielectric straps forming a coaxial configuration, which includes a core conductor separated by an air gap, facilitating high-speed data transfer through differential signaling and reducing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If parallel data link channels are increased to improve data throughput, then data rate improves, but power dissipation and heat generation increase
Solution Approach 1:
The patent transitions from two-dimensional PCB trace interconnects to three-dimensional microstructured coaxial cables with conductive shields and dielectric straps, enabling higher data rates per channel without proportionally increasing power consumption. This dimensional change allows for better signal integrity and reduced interference, achieving up to 100 Gb/s per channel.
Solution Approach 2:
The invention replaces traditional mechanical/electrical PCB trace systems with a hybrid system incorporating flexible coaxial cable structures. This substitution provides controlled impedance and shielding benefits that reduce power dissipation while maintaining high data throughput capabilities.
2Productivity
If the number of I/O pads is increased to support more parallel data links, then data rate improves, but device complexity and routing difficulty increase
Solution Approach 1:
By moving from planar PCB routing to three-dimensional microstructured cable assemblies, the patent reduces the number of required I/O pads and simplifies routing. The flexible coaxial structure can be routed through three-dimensional space, avoiding the constraints of two-dimensional PCB trace routing and reducing overall device complexity.
3Speed
If serial data link rates are increased beyond conventional capabilities, then data throughput improves, but signal distortion increases requiring equalization stages
Solution Approach 1:
The patent introduces flexible coaxial cable structures with conductive shields and dielectric straps as intermediaries between devices. These structures provide controlled impedance and signal confinement, acting as mediators that maintain signal integrity at high data rates without requiring additional equalization stages. The coaxial geometry inherently provides better signal confinement compared to traditional PCB traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables data transfer rates above 100 Gb/s, reduces the number of required interconnects by up to 90%, saves space, lowers costs, and enhances reliability by minimizing noise and power consumption.
Implementation Method 1
the methods that have been used before are now becoming a limiting factor given the advances in chip speeds... Advanced substrate materials such as Liquid Crystal Polymer (LCP) have helped to extend the frequency range (and bit rates) that can be handled
Implementation Method 2
The one or more conductors within the shield is/are separated from the conductive shield by an air gap
Implementation Method 3
The two conductors of the digital data interconnect are electrically connected to first and second electrical contacts of a first digital data device disposed on the substrate. Thereafter, digital data is communicated from the first digital data device to a second digital data device disposed on the substrate by using the first and second conductors to facilitate a differential signaling mode
Data Source
AI summary
Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.