3D Module Integrated Passive Components
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Solution Overview
Problem
The installation of multilayer ceramic capacitors in electronic modules is time-consuming and costly due to their large size and discrete nature, and existing ceramic materials have limitations in dielectric constant and conductive properties, which hinder the integration of passive components in compact electronic modules.
Innovation Solution
A three-dimensional module with integrated passive components, where each device level comprises high-k dielectric material fired at a high temperature and interconnect levels comprise low-k dielectric material fired at a lower temperature, allowing for independent firing and integration of capacitors with co-planar surfaces, reducing installation time and cost, and enhancing dielectric quality and conductive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multilayer ceramic capacitors are used as discrete components, then capacitance values can range from pF to uF, but installation time and cost increase significantly
Solution Approach 1:
The patent merges multiple discrete capacitor components into a single integrated multilayer ceramic capacitor structure. By stacking multiple dielectric layers with internal electrodes in a monolithic configuration, the invention enables one capacitor component to provide multiple capacitance values (e.g., first capacitor with first capacitance value, second capacitor with second capacitance value) within a single device, thereby eliminating the need for multiple separate components and reducing installation time while maintaining adaptability across different capacitance ranges from pF to uF
Solution Approach 2:
The multilayer ceramic capacitor structure is designed to perform multiple functions within a single component. Each capacitor structure can simultaneously provide different capacitance values through its internal layered architecture, where different combinations of dielectric layers and internal electrodes create multiple capacitive elements. This multi-functionality allows a single universal component to replace multiple specialized discrete capacitors, improving productivity without sacrificing adaptability
2Quantity of substance
If high-k dielectric material is used to increase capacitance, then capacitance value increases, but firing temperature must be very high
Solution Approach 1:
The patent employs composite material strategies by combining high-k dielectric materials with specific metal electrode materials in a multilayer structure. The dielectric layers contain high-k materials (such as barium titanate, lead zirconate titanate, or other ceramic compositions) that provide high capacitance values, while the metal electrodes (such as nickel, palladium, or copper) are selected for their compatibility with the high-k dielectric and their ability to be fired at optimized temperatures. This composite approach allows achieving high capacitance values while managing firing temperature requirements through material compatibility and optimized processing
3Quantity of substance
If capacitor thickness is increased to achieve higher capacitance, then capacitance value increases, but module footprint increases
Solution Approach 1:
The patent transitions from increasing capacitance through vertical thickness expansion to achieving high capacitance through horizontal layer multiplication. By stacking multiple thin dielectric layers with internal electrodes in a multilayer configuration, the invention increases the effective capacitance area within the same footprint. The capacitance is enhanced by adding more layers (increasing the number of capacitive elements) rather than increasing the thickness of individual layers, thereby maintaining a compact module footprint while achieving high capacitance values through dimensional optimization in the layered architecture
4Reliability
If discrete capacitors are installed separately, then each capacitor can be optimized for its specific capacitance, but installation cost increases
Solution Approach 1:
The patent combines multiple optimized capacitor functions into a single integrated manufacturing process. Instead of separately optimizing and installing multiple discrete capacitors, the invention optimizes the entire multilayer structure in one manufacturing process, where dielectric layers and internal electrodes are patterned and assembled together to create multiple capacitive elements with different capacitance values. This unified approach maintains the ability to optimize each capacitor's performance while significantly reducing installation cost by requiring only a single component installation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-performance electronic module with reduced installation time and cost, improved dielectric quality, and increased capacitance range by allowing independent firing of high-k dielectric materials and using low-k dielectric materials for faster interconnects, addressing the limitations of existing HTCC and LTCC structures.
Implementation Method 1
The ceramic body comprises a capacitive portion and a dummy portion... each device level includes a plurality of passive components fired integrally and comprising at least one layer of a first high-k dielectric material
Implementation Method 2
each interconnect level comprises at least one layer of a low-k dielectric material... independent firing of high-k dielectric materials and using low-k dielectric materials for faster interconnects
Implementation Method 3
all high-k dielectric layers and all internal electrode layers are fired together in a single firing step
Data Source
AI summary
A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.