3D Molded Electronics With Embedded Components for Harsh Environments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices lack the ability to create three-dimensionally non-planar structures with complex electronic functionalities, limiting their mechanical robustness and electrical reliability, especially in harsh environments.
Innovation Solution
A three-dimensionally non-planar electronic device is created using a mold body with an electrically conductive structure on its surface and at least one electric entity embedded or partially inside, allowing for sophisticated electronic functionality and mechanical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional planar structures are used, then manufacturing is simpler, but mechanical robustness and electrical reliability are reduced
Solution Approach 1:
The patent transitions from conventional two-dimensional planar structures to three-dimensional non-planar mold bodies with curved surfaces. This dimensional change allows the mold body to define complex spatial geometries that enhance both mechanical robustness and electrical reliability while enabling sophisticated electronic functionalities that cannot be achieved with flat configurations.
Solution Approach 2:
The patent employs a mold body comprising a resin matrix with filler particles therein. The resin matrix provides electric insulation, while the filler particles functionalize the mold body with properties such as reduced density, enhanced thermal conductivity, or improved mechanical strength. This composite material approach resolves the contradiction by combining materials with complementary properties to achieve both structural integrity and electrical performance in the three-dimensional configuration.
2Adaptability or versatility
If mold body with embedded electric entities is used, then electronic functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent embeds electric entities within the mold body during the molding process itself, rather than adding them separately afterward. This preliminary action allows the electric entities to be integrated into the three-dimensional structure as it is being formed, simplifying the overall manufacturing process despite the complexity of the final product. The mold body is cured in situ with the electric entities already positioned, ensuring proper integration.
Solution Approach 2:
The patent embeds electric entities within the three-dimensionally non-planar mold body, creating a nested structure where electric components are housed inside the molded structure. This nesting approach allows sophisticated electronic functionalities to be integrated within the compact three-dimensional form factor, enhancing adaptability while managing manufacturing complexity through a unified molding process.
3Adaptability or versatility
If three-dimensionally non-planar mold body is used, then design freedom is increased, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes thermally responsive properties of the mold compound, which softens when heated and hardens when cooled. By controlling temperature parameters during the molding process, the system can accommodate the complexities of three-dimensionally non-planar geometries. The mold compound's viscosity and flow characteristics change with temperature, allowing precise formation of curved surfaces and complex shapes while managing the high precision requirements through thermal parameter control.
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
An electronic device (100) which comprises a three-dimensionally non-planar mold body (102) defining at least part of one of a non-planar side surface (104) and an opposed non-planar side surface (106) of the electronic device (100), an electrically conductive structure (114) provided on one of said non-planar side surface (104) and said opposing non-planar side surface (106), and at least one electric entity (108) at least partially inside of the three-dimensionally non-planar mold body (102).