3D Molding and Component Mounting for Multi-Component Throughput
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Solution Overview
Problem
Existing three-dimensional molding machines and component mounting machines suffer from low production efficiency, especially when manufacturing molded objects with electronic circuits, as they require manual component mounting and inefficient tray replacement for multiple types of electronic components.
Innovation Solution
A three-dimensional molding machine with integrated devices for molding, circuit formation, and component mounting, along with conveyance systems for efficient handling of molded objects and electronic components, and a component mounting machine capable of supplying multiple types of components from a single pallet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If manual component mounting is performed during molding, then electronic components can be mounted on molded objects, but production efficiency is remarkably low
Solution Approach 1:
The patent combines the molding process and component mounting process into a single integrated system. The component mounting device is positioned to operate simultaneously with the molding device on the same molded object, eliminating the need for separate manual mounting operations and significantly improving production efficiency
Solution Approach 2:
The patent enables continuous operation by having the component mounting device operate during the molding process itself. Components are mounted on the molded object while it is still in the molding device, allowing the process to continue without interruption rather than requiring pause for manual mounting
2Adaptability or versatility
If trays are selectively pulled out from multi-stage tray units for different component types, then multiple types of electronic components can be supplied, but frequent tray replacement reduces production efficiency
Solution Approach 1:
The patent uses a single tray that can supply multiple types of electronic components through multiple cavities. This universal tray design eliminates the need for selective tray pulling and frequent replacements, as one tray serves all component types required for the molded object
Solution Approach 2:
The patent structures the tray with multiple cavities that can accommodate different types of electronic components in a nested arrangement. This allows multiple component types to be supplied from a single tray structure, reducing the number of trays needed and eliminating frequent tray replacement operations
Data Source
AI summary
A three-dimensional molding machine includes a three-dimensional molding device configured to mold a three-dimensional molded object on a molding pallet, a circuit forming device configured to form a circuit pattern on the molded object during or after molding, a component mounting device configured to mount an electronic component on the circuit pattern formed on the molded object, a pallet conveyance device configured to convey the molded object together with the molding pallet between the three-dimensional molding device, the circuit forming device, and the component mounting device, and a component conveyance device configured to the electronic components into the component mounting device from an outside of the machine.