3D Multi-IC Interconnect Structure for Heat and Alignment Control
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Solution Overview
Problem
Current 3D integrated multi-IC systems face challenges with heat dissipation, precision alignment, and limited vertical stacking due to the use of flexible film connectors, which can distort and cause overheating, and require complex production processes and large space for contact pads.
Innovation Solution
A three-dimensionally integrated multi-IC system with passive interconnect components having vertically extending signal line structures that connect ICs across substrate levels, allowing for precise alignment and larger contact pads to compensate for substrate distortion, reducing heat generation and increasing vertical stacking capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible foil connectors are used to compensate for height differences between ICs, then height compensation is achieved, but heat dissipation is impaired and manufacturing complexity increases
Solution Approach 1:
The patent introduces an intermediary component (adjustment element) between the IC component and the substrate that serves as a mediator for height compensation. This adjustment element acts as a separate functional component that absorbs height differences without requiring the substrate itself to be flexible, thereby maintaining good thermal contact while achieving height adaptation.
Solution Approach 2:
The patent divides the height compensation function into a separate adjustment element rather than making the entire substrate flexible. This segmentation allows the substrate to remain rigid for good heat dissipation while the dedicated adjustment element handles the height compensation task, separating the thermal management function from the mechanical adaptation function.
2Adaptability or versatility
If flexible foil connectors are used to compensate for height differences, then height compensation is achieved, but manufacturing complexity and production difficulty increase
Solution Approach 1:
The adjustment element serves as an intermediary component that simplifies manufacturing by providing a standardized solution for height compensation. Rather than requiring complex flexible substrate fabrication and wing bending processes, the patent uses a separate adjustment element that can be independently manufactured and positioned, reducing overall manufacturing complexity.
3Adaptability or versatility
If flat contact pads are used on flexible substrates, then height differences are compensated, but alignment precision deteriorates due to substrate warpage
Solution Approach 1:
The patent separates the height compensation function from the alignment function. The rigid substrate maintains stable alignment characteristics, while a separate adjustment element handles height compensation. This segmentation prevents the coupling of warpage effects with alignment precision that occurs in flexible substrate designs.
Solution Approach 2:
The adjustment element acts as an intermediary between the rigid substrate and the IC component, providing height adaptation without introducing the warpage and alignment issues associated with flexible substrates. This intermediary approach maintains the dimensional stability of the rigid substrate while achieving the necessary height compensation.
4Manufacturing precision
If larger contact pads are used to compensate for substrate distortion, then alignment tolerance is improved, but lateral space requirements increase
Solution Approach 1:
The patent separates the alignment function from the height compensation function, allowing small contact pads to be used on the rigid substrate for precise alignment while the adjustment element handles height compensation. This segmentation eliminates the need for large contact pads that would be required if the substrate itself were used for both alignment and height compensation.
Data Source
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Figure 2A
AI summary
The concept disclosed herein relates to a three-dimensionally integrated multi-IC system (100) with a substrate stack (110) comprising several vertically stacked substrates (111, 112, 113), each substrate (111, 112, 113) defining a substrate level. Active IC components (120) are arranged on the individual substrates (111, 112, 113) and are electrically interconnected within their respective substrate levels. According to the invention, passive interconnect components (130) are proposed, arranged between two adjacent substrates (111, 112, 113), each interconnect component having vertically extending signal lines (131) configured to establish an electrical connection between any two adjacent substrates (111, 112, 113).