3D Multi-IC Interconnect Structure for Dense Vertical Stacking
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Solution Overview
Problem
Current 3D integration methods for semiconductor ICs face challenges such as overheating, deformation of flexible interposers, and limited vertical stacking due to the use of flat contact pads and flexible film connectors, which lead to geometric distortions and reduced integration density.
Innovation Solution
A three-dimensionally integrated multi-IC system with vertically stacked substrates and passive interconnect components featuring vertically extending signal line structures for electrical connections between substrates, allowing precise alignment and larger contact pads to compensate for distortions, reducing heat generation and increasing integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible film connectors with flat contact pads are used to connect ICs with different heights, then height differences can be compensated, but the ICs are enveloped causing waste heat to build up under the interposer leading to overheating
Solution Approach 1:
The interposer is divided into a rigid base portion and separate flexible connection portions. The rigid base provides stable electrical connection and heat dissipation, while the flexible portions independently adapt to height differences without enveloping the IC, thus preventing heat buildup under the interposer.
Solution Approach 2:
A rigid base portion acts as an intermediary between the IC and the flexible connection portions. This rigid structure provides a stable thermal and electrical pathway while allowing the flexible portions to compensate for height variations without causing overheating.
2Adaptability or versatility
If flexible film connectors with wings are used to compensate for height differences, then ICs with different heights can be connected, but the interposer is deformed and production becomes more complex
Solution Approach 1:
The interposer is segmented into a rigid base portion and separate flexible connection portions. This segmentation allows each part to perform its specific function independently, simplifying the overall structure and manufacturing process while maintaining the ability to compensate for height differences.
Solution Approach 2:
Instead of making the entire interposer flexible with deforming wings, the invention inverts the approach by using a rigid base with separate flexible connection elements. This inversion simplifies production while achieving the same height compensation function.
3Adaptability or versatility
If flat contact pads are used on the interposer, then ICs with different pad configurations can be connected, but the number of layers that can be stacked is limited because the wings do not reach down to the substrate over several stacked levels
Solution Approach 1:
The interposer is segmented into a rigid base portion that provides stable electrical connection and separate flexible connection portions that can extend vertically. This segmentation enables the flexible portions to reach down to substrates in multi-layer stacks while the rigid base maintains reliable electrical contact.
Solution Approach 2:
The flexible connection portions extend in the vertical dimension, allowing the interposer to bridge multiple stacked layers. This dimensional extension overcomes the limitation of flat contact pads and enables higher vertical stacking density.
4Productivity
If the number of vertical IC stacks is increased to improve integration density, then computing power increases, but heat dissipation becomes more difficult
Solution Approach 1:
The rigid base portion of the interposer acts as a thermal intermediary, providing efficient heat pathways between stacked ICs and the substrate. This rigid structure with optimized thermal conductivity enables effective heat dissipation even as the number of vertical stacks increases.
Solution Approach 2:
The rigid base portion serves multiple functions simultaneously: electrical connection, mechanical support, and heat dissipation. This multi-functionality allows the interposer to support higher integration density while maintaining effective thermal management across multiple stacked layers.
Data Source
AI summary
The concept according to the invention disclosed herein relates to a three-dimensionally integrated multi-IC system having a substrate stack which has several substrates stacked vertically one above the other, each substrate defining a respective substrate plane. Active IC components which are electrically interconnected in the respective substrate plane are arranged on the individual substrates. According to the invention, passive interconnect components are suggested which are arranged between two adjacent substrates, wherein the interconnect component each have vertically extending signal line structures configured to establish an electrical connection between two adjacent substrates each.